TopLine

95 Highway 22W
Milledgeville,  GA  31061

United States
http://www.TopLine.tv
  • Booth: 504


TopLine CCGA - Column Grid Array and Tanaka Bonding Wire

CCGA Ceramic Column Grid Array absorbs large stresses due to the CTE mismatch of the material's coefficient of temperature expansion between a ceramic module and orgainic circuit boards.

The solution for overcoming CTE mismatching is to use solder columns (instead of solder balls), making a device known as a Ceramic Column Grid array (CCGA).

Solder columns are compliant and absorb stresses caused by stretching and pulling in applications involving high vibration, shock and varying temperatures.

CCGA have been used for decades by well known chip makers.


 Press Releases

  • TopLine’s CCGA Column Grid Array IC packages are made with non-collapsible solder columns. Column pillars and provide more compliancy than solder balls  (BGA) to absorb stress and increase solder joint reliability under harsh operating conditions. Solder column pillars reduce stress caused by CTE mismatch when interconnecting large area array packages to PC boards. For more information, and a quick chart of TopLine CCGA products, visit http://www.topline.tv/CCGA.html.


 Products

  • Gold Ribbon Bonding Wire
    Gold Ribbon Bonding Wire for high power, high temperature and RF applications. Booth 504....

  • Gold Ribbon Bonding Wire for high power, high temperature and RF applications.  Ribbon sizes 50um to 250um wide (2mil to 10mil). Gold Ribbon is made using a rolled process. Edges are smooth without sharp edges. Good surface smoothness. Quick delivery. Made by Tanaka.
  • CCGA - COLUMN GRID ARRAY
    CCGA with Solder Columns (Pillars) reduce stress on large semiconductor IC packages. Booth 504....

  • CCGA with Solder Columns (Pillars) reduce stress on large semiconductor IC packages. More reliable than BGA packages. CCGA absorb stress caused by CTE mismatch of materials. Wide variety of column solutions including: High Temperature, Micro-Coil Spring, Copper Pillars, Copper Braided columns and copper wrapped columns.
  • Micro-Coil Spring CCGA Array
    Micro-Coil semiconductor packages. Invented at NASA. Strong for harsh environments. Better than BGA. Booth 504...

  • Micro-Coil semiconductor packages. Invented at NASA. Strong for harsh environments. Better than BGA. Booth 504

 Additional Info

New Exhibitor:
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New Products:
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Displaying Equipment:
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Product Demonstrations:
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Please indicate which industries/technologies your company serves
Semiconductor

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