Semiconductor Equipment Corporation

5154 Goldman Ave
Moorpark,  CA  93021

United States
  • Booth: 5962

Welcome and explore our new website:

SEMICONDUCTOR EQUIPMENT CORP. Manufacturer and distributor of manual, semiautomatic, and automatic equipment for the Photonics, Semiconductor, MEMS, SMT and Hybrid Industries. Back end products include flip-chip bonders, ultrasonic die bonders, laser diode bonders, eutectic die bonders, manual pick & place, epoxy die bonders, die rework, dicing tape, manual and automatic dicing tape applicators, UV tape curing system, backgrinding tape, backgrinding tape applicators, backgrinding tape peelers, and die ejectors. Front end products include semiautomatic and fully automatic cassette, SMIF, RSP, FOSB, FOUP, and EUV pod cleaning systems.


  • Model 365 UV Tape Curing System
    Revolutionary new design cures UV tapes quickly and uniformly, features a long life light source and handles all size wafers up to 300mm. Cures most UV tapes in 5 seconds. The Model 365 needs no external ventilation and has a small footprint. ...

  • Model 365 Capabilities:

    · Cures most UV tape in 5 seconds

    · Large exposure area cures up to 300mm wafers.

    · Film Frame masks available.

    · Programmable N2 purge and cure time

    · Touch screen control

    · Safety interlock to prevent operator exposure to UV light

    · Self diagnostic (alarm if LED fails, identifies faulty LED module)

    · 10,000 hour LED life

    · Generates no ozone

    · Cooling fans temperature controlled

 Additional Info

New Exhibitor:
New Products:
Displaying Equipment:
Product Demonstrations:
Please indicate which industries/technologies your company serves
LED/solid state lighting, MEMS, Photovoltaic, Plastic/organic/flexible electronics, Power Semiconductors, Semiconductor

Send Email

Type your information and click "Send Email" to send an email to this exhibitor. To return to the previous screen without saving, click "Reset".