Semiconductor Equipment Corporation

5154 Goldman Ave
Moorpark,  CA  93021

United States
http://www.semicorp.com
  • Booth: 5962


Welcome and explore our new website: semicorp.com

SEMICONDUCTOR EQUIPMENT CORP. Manufacturer and distributor of manual, semiautomatic, and automatic equipment for the Photonics, Semiconductor, MEMS, SMT and Hybrid Industries. Back end products include flip-chip bonders, ultrasonic die bonders, laser diode bonders, eutectic die bonders, manual pick & place, epoxy die bonders, die rework, dicing tape, manual and automatic dicing tape applicators, UV tape curing system, backgrinding tape, backgrinding tape applicators, backgrinding tape peelers, and die ejectors. Front end products include semiautomatic and fully automatic cassette, SMIF, RSP, FOSB, FOUP, and EUV pod cleaning systems.


 Products

  • Model 365 UV Tape Curing System
    Revolutionary new design cures UV tapes quickly and uniformly, features a long life light source and handles all size wafers up to 300mm. Cures most UV tapes in 5 seconds. The Model 365 needs no external ventilation and has a small footprint. ...

  • Model 365 Capabilities:

    · Cures most UV tape in 5 seconds

    · Large exposure area cures up to 300mm wafers.

    · Film Frame masks available.

    · Programmable N2 purge and cure time

    · Touch screen control

    · Safety interlock to prevent operator exposure to UV light

    · Self diagnostic (alarm if LED fails, identifies faulty LED module)

    · 10,000 hour LED life

    · Generates no ozone

    · Cooling fans temperature controlled

  • Model 865 Flip Chip Bonder
    The Model 865 Flip Chip Die Bonder is ideal for R & D and low volume production. Applications include solder and gold bumped flip chip, AuSn eutectic, thermosonic, thermocompression, and epoxy bonding...

    •  Placement accuracy within 1 micron.
    •  Interchangeable stages and bond heads.
    •  Rapid thermal cycling.
    •  Automated process control with recipes saved in memory.
    •  Motorized true vertical bond head movement.
    •  Closed loop bond load control with 1 gram resolution.
    •  Modular options for flexible system configuration.
    •  Motorized look up look down viewer.
    •  Compact footprint.
    •  Custom features available to suit your application.

  • Model SC-8 Semi-Automatic Cassette and Box Cleanin
    The Hugle SC-8 is the solution you need to clean all types of wafer carriers and boxes up to 8” in a single system....

  • The SC-8 is a new generation semi-automatic cassette and box cleaning system. This model features energy efficient, space saving, trouble free design. Special water and air nozzles wash and dry containers as they are transported through the system in wire trays. Hugle has built on the strong performance and reliable design of the earlier CRD-4500. There are also design improvements that increase drying efficiency and reduce system cost. Cost savings have resulted in substantial price reductions.

    Features

    • Several kinds of container can be washed
    • Small foot print/Energy Saving design
    • Hugle Super-precision cleaning by our unique washing
    • Highly efficient hot air knife for quick drying
    • Surfactant wash, DIW rinse feature available
    • Compliance to various standards (SEMI standard,CE marking,UL)
    • Can accommodate many kinds of containers up to 8”
    • Easy operation with touch panel screen
    • Process recipe setting per tray
    • Outstanding washing/and drying performance
    • Equipped with Anti-static device
    • Over 300 installed base shows high reliability

 Additional Info

New Exhibitor:
No
New Products:
Yes
Displaying Equipment:
Yes
Product Demonstrations:
Yes
Please indicate which industries/technologies your company serves
LED/solid state lighting, MEMS, Photovoltaic, Plastic/organic/flexible electronics, Power Semiconductors, Semiconductor

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