Pentamaster is one of the pioneer burn-in test solutions providers for wafer-level packages such as VCSELs, Silicon Carbides (SiC), Micro LEDs and LEDs. Our Burn-in Test Solutions help to deliver fully tested and highly reliable dies before module assembly to help manufacturers save cost while gaining higher ROI.
The global market’s demand for VCSELs, Silicon Carbide (SiC), Micro LEDs and LEDs are expanding a lot quicker than ever before as technology is also constantly rapidly evolving. For instance, VCSELs are rapidly adopted in the 3D sensor segments for applications such as facial recognitions and LiDAR. Silicon Carbide on the other hand plays a huge role in the development of electrical vehicles (EV) while Micro LEDs is an emerging flat-panel display for smart devices offering brighter, slimmer design and is less prone to burn-in defects.
This places a huge challenge onto manufacturers in ensuring that their products had been stringently tested for their performance and reliabilities through burn-in tests at wafer-level to phase out early life failures and defects. One of the key benefits to performing burn-in test onto packages at wafer-level is because it helps to save cost by reducing unnecessary wastages down the line as well as shorter cycle times before the wafer is packaged.