Brush System

A Revolution in Wafer Cleaning Technology

The first PVA brush design innovation in over 20 years

The TechCore PVA Brush System maximizes the efficiency of DI water and cleaning chemistries, revolutionizing the wafer cleaning process.

With the TechCore PVA brush, you'll witness a significant reduction in contaminating particles, translating to less break-in time, minimized wafer defects and significantly increased wafer production yields. The optimized fluid distribution delivers even cleaning performance and superior purging of contaminants.

The patent pending design of the TechCore PVA brush reduces DI water and chemistries usage up to 47% , uses 70% less PVA than standard brushes resulting in fewer residual PVA particles.

Increased Yields 70% Less PVA 47% Less DI Water Less Break In Time Eco Friendly

TechCore PVA Brush System

• Less PVA
  
• Low level of contaminants
  
• Accelerated brush break-in
  
• Fluids flows exclusively through nodule
  
• Reduces DI and Chemistries usage
  
• Minimized environmental footprint
  

*Colors are for illustrative purposes only

Industry-Standard Brush

• Thick PVA Body
• High level of contaminates
  
• Long break-in
• Undirected waterflow
• High water usage
• Significant environmental impact