MAGAZINE
April/May
What’s in the April/May Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the April/May issue.
SEMICON Southeast Asia 2024 Opens Today
Themed Boosting Agility and Resiliency of the Global Electronics Supply Chain, SEMICON Southeast Asia 2024 opens today at MITEC in Kuala Lumpur with visionaries and experts gathered for insights into the latest industry developments, trends and innovations and critical areas including sustainability, smart manufacturing, and workforce development.
New Survey to Access Job Skills Needs in Europe’s Microelectronics Industry
SEMI invites key industry stakeholders to participate in a survey designed to access job skills in highest demand in Europe’s microelectronics industry in 2024.
What’s in the April/May Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the April/May issue.
IEEE International Electron Devices Meeting (IEDM) Announces 2024 Call for Papers
Under the theme “Shaping Tomorrow’s Semiconductor Technology,” the 70th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development.
EV Group Doubles Throughput of Semiconductor Layer Transfer Tech with EVG LayerRelease System
Dedicated HVM equipment platform boosts productivity and lowers cost-of-ownership of novel infrared laser release technology through silicon carrier wafers for 3D integration applications.
NY CREATES and Raytheon Unveil Collaborative Semiconductor Workforce Training Initiative
The New York Center for Research, Economic Advancement, Technology, Engineering, and Science (NY CREATES), in collaboration with Raytheon, an RTX business, announced the deployment of the NY CREATES/Raytheon Workforce Training Program.
Biden-Harris Administration Announces CHIPS Act Funds for Absolics for Development of Glass Substrate Technology
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Absolics, an affiliate of the Korea-based SKC, have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $75 million in direct funding under the CHIPS and Science Act to help advance U.S. technology leadership.
SEMIFIVE Signs MOU with Atron Technologies
SEMIFIVE, a design solution provider and pioneer of platform-based custom silicon solutions, has announced its agreement of MOU with China-based Atron Technologies, on May 23, 2024.
How a Tiny Device Could Lead to Big Physics Discoveries and Better Lasers
Rensselaer Polytechnic Institute researchers have created the first topological quantum simulator device in the strong light-matter interaction regime that operates at room temperature.
SIA Applauds CHIPS Act Incentives for Absolics Project in Georgia
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Commerce Department and Absolics, an affiliate of the Korea-based SKC.
SEALSQ RISC-V Chips Adoption is Predicted to Get AI Boost Making it a Viable Competitor to Traditional GPUs
RISC-V technology is revolutionizing the microchip industry, challenging established giants and paving the way for transformative changes. By the end of 2022, the industry had already embraced over 10 billion RISC-V cores, with thousands of engineers globally contributing to RISC-V projects.
The Dominican Republic and Purdue University Sign MOU to Drive Semiconductor Growth
The Ministry of Industry, Commerce, and MSMEs of the Dominican Republic (MICM) announced a significant Memorandum of Understanding (MOU) with Purdue University to propel the country’s semiconductor industry and national development.
NHanced Semiconductors Launches New Website
Redesigned website showcases the company’s innovative Foundry 2.0 manufacturing model, with intuitive navigation and more news and blog options.
Alpha and Omega Semiconductor Introduces Half-Bridge MOSFET for DC-DC Applications
By reducing the footprint size to enable a more efficient high-power design, the AONG36322 XSPairFET provides a leading solution for space-constrained DC-DC Buck applications.
Lattice Introduces Advanced 3D Sensor Fusion Reference Design for Autonomous Applications
Lattice Semiconductor, the low power programmable leader, today announced a new 3D sensor fusion reference design to accelerate advanced autonomous application development.
Toshiba Completes New 300mm Wafer Fabrication Facility for Power Semiconductors
Toshiba Electronic Devices & Storage Corporation today held a ceremony to mark the completion of a new 300mm wafer fabrication facility for power semiconductors and an office building at Kaga Toshiba Electronics Corporation in Ishikawa Prefecture, Japan.
ROHM Semiconductor and Nanjing SemiDrive Technology Jointly Develop a Reference Design
ROHM Semiconductor and Nanjing SemiDrive Technology Ltd., China’s largest SoC manufacturer for smart cockpits, today announced they have jointly developed a smart cockpit reference design.
ThinkLabs AI, Inc. Launches and Secures $5M Seed Investment
New startup is developing a digital assistant that leverages a proprietary physics-informed AI digital twin and provides enhanced situational awareness capabilities so control room operators can maintain grid reliability.
Wearable Devices Get Signal Boost from Innovative Material
Rice engineer and collaborators overcome radio frequency performance challenges in skin-interfaced electronics.
Mobix Labs Completes Acquisition of RaGE Systems
RaGE Systems specializes in developing products for 5G communications, mmWave imaging, and Software Defined Radio systems targeting commercial, industrial, defense, and aerospace sectors.
Arctic Semiconductor Announces 3GPP Compliant Platform for 5G Private Networks
Arctic Semiconductor today announced that its low power, high performance 4×4 transceiver IceWings is powering a new small cell platform that has passed 3GPP specification and will soon be available in mass production.
Andes Technology and Arteris Partner To Accelerate RISC-V SoC Adoption
Andes Technology and Arteris partnership aims to support the growing adoption of RISC-V SoCs by mutual customers.
Wise-integration & Leadtrend Technology Introduce GaN System-in-Package
Wise-integration and Leadtrend Technology Corporation, a specialist in analog and analog-digital mixed-mode IC designs, today announced the release of a GaN system-in-package (SiP) supporting consumer electronics applications.
Featured Video
Is your semiconductor plant seeking methods to enhance sustainability in wafer manufacturing and water reclamation? The semiconductor sector faces two challenges: waste reduction and water usage. The use of on-line water analytics can assist in overseeing water quality in both wafer manufacturing and reclamation/reuse procedures. This video underscores the significance of monitoring the levels of conductivity, TOC, and microbes to identify impurities that may lead to rejected wafers. Monitoring these parameters also ensures the purity of water to improve wafer quality and yield. Furthermore, this video emphasizes the importance of monitoring the levels of dissolved oxygen, TOC, and pH in waste streams to optimize water recovery.
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U.S. Aims for 20% of World’s Leading Edge Semiconductor Production by 2030
Secretary of Commerce Gina Raimondo believes investments in leading-edge logic chips manufacturing will put the U.S. on track to produce roughly 20 percent of the world’s leading-edge logic chips by the end of the decade.
Water Supply Challenges for the Semiconductor Industry
The energy-hungry nature and large carbon footprint of semiconductor manufacturing have received considerable attention in the context of reducing our emissions of planet-warming greenhouse gases. It turns out we are just as thirsty as we are hungry.
Professors from MIT, UCLA to be Honored for Excellence in Semiconductor Research
The Semiconductor Industry Association (SIA), in collaboration with the Semiconductor Research Corporation (SRC), today announced the winners of its 2019 University Research Awards.
What Do Small Companies Need to Know about the CHIPS Act?
IBM’s Poughkeepsie, N.Y. site was the backdrop for one of President Biden’s speeches promoting the passage of the $52B CHIPS (Creating Helpful Incentives to Produce Semiconductors) and Science Act, a rare piece of legislation for which the president won bipartisan support.
Intel 4 Process Drops Cobalt Interconnect, Goes with Tried and Tested Copper with Cobalt Liner/Cap
At the VLSI Symposia in June, Intel presented a paper “Intel 4 CMOS Technology Featuring Advanced FinFET Transistors Optimized for High Density and High-Performance Computing.” Blogger Dick James reports on details of the interconnect strategy.
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