Applied Microengineering Ltd.

Applied Microengineering Ltd (AML) design and manufacture wafer-bonding systems with integrated wafer-to-wafer alignment capabilities; the ROCK systems, with integral cryopump, offer UHV vacuum levels in the 10-8mbar range.

The ROCK-04 system is designed for bonding 3”, 4” and 6” wafer sizes, and the ROCK-08 system for larger 6” and 8” wafers.

The systems offer the capabilities for a wide range of bonding techniques, including anodic, direct, eutectic, thermocompression, adhesive etc.  All process steps - surface treatment, wafer-wafer alignment and bonding - can be carried out sequentially within the same chamber without any further exposure to air.

Align and bond in one system!  As with the AWB system, the ROCK offers flexibility and important advantages when developing advanced bonding processes, and the in-situ alignment facility avoids the need for two separate systems – reducing cost and simplifying operation, and minimising cleanroom space requirements.

Applied Microengineering Ltd (AML) design and manufacture wafer-bonding systems with integrated wafer-to-wafer alignment capabilities; the AWB-04 system is designed for bonding 3”, 4” and 6” wafer sizes and the AWB-08 system for larger 6” and 8” wafers.

The AWB systems offer the capabilities for a wide range of bonding techniques including anodic, direct, eutectic, thermocompression, adhesive etc., and feature an integral, optical wafer-to-wafer alignment system as standard, with +/- 1µm accuracy.

Following (manual) loading of the wafers into the chamber, all process steps can be carried out sequentially without any further exposure to air:  treatment of the wafer surfaces, wafer alignment and bonding.

Align and bond in one system!  The AWB system offers flexibility and important advantages when developing processes, and avoids the need for two separate systems – reducing cost and simplifying operation, and minimising the cleanroom space requirements.