SANTEC CORPORATION, a leading manufacturer of advanced optical components, tunable lasers, optical test equipment and OCT systems, announces the high-accuracy wafer thickness mapping system, TMS-2000. The TMS-2000 uses an interferometric detection technique with a high-speed tunable laser to measure the flatness of the wafer of up to 1 nm repeatability for global, site and edge measurements of the wafer. Conventional wafer thickness mapping techniques struggle with accuracy issues when used in unstable environments involving extreme temperature changes and vibrations while the TMS-2000 has high environmental stability. Thanks to its high-speed measurement capability and compact size, the TMS-2000 can be used in various industrial fields involving in-line inspection. The TMS-2000 Thickness Mapping System will be debuted at Semicon West booth #1840 at Moscone Center from July 11 – 13, 2023.
About SANTEC
SANTEC CORPORATION was established in 1979. It is headquartered in Komaki, Aichi, Japan and has sales offices in North America (SANTEC U.S.A CORPORATION in NJ), U.K. (SANTEC EUROPE LTD. in Oxfordshire) and China (SANTEC (Shanghai) Co., Ltd.in Shanghai). SANTEC is listed on the Standard Market (6777) –a section of the Tokyo Stock Exchange. The company employs 273 staff members and serves a global customer base; including the world’s major telecommunications companies, transmission/sub system manufacturers, internationally recognized research centers and universities. SANTEC’s product lines include a broad range of advanced optical components, tunable lasers, optical test/measurement and OCT systems for telecommunication, life science, sensing and industry applications.