FSM offers a range of advanced metrology products/solutions
Overview
FSM solutions for:
Product Inline Inspection
Application Development
1. Film Stress Metrology
Global Stress
FSM 128 Series
Room Temperature Wafer Film Stress
FSM 500 Series
Wafer Film Stress Measurement up to 500°C FSM 900 Series
Wafer Film Stress Measurement and Material Characterization up to 900°C in Vacuum
2. Wafer & Film Thickness Metrology
FSM 413
Wafer Thickness, Total Thickness Variation, Through- Silicon Via, Roughness, Thin- film Thickness,
(TTV for ultra thin wafer: Taiko wafer)
FSM 125 RAFT
Thickness in Nanometer Range
Sample Transparent Film Thickness Measurement Film should be ticker than 1um
3. Electrical Tester
Non-contact Electrical Tester for Sheet Resistance, Leakage Current and Photo-Voltage
Contact Electrical Tester FSM 4 Point Probe
Contact Electrical Tester for Sheet Resistance Mapping
4. Material Characterization
FSM 900TC-VAC Stress, Thermal Desorption Spectroscopy, Reflectivity, Shrinkage, CTE optimization study, 4-point probe option for sheet resistance,
FSM 901TC-VAC Thermal Desorption Spectroscopy
FSM AquaFlex (4 Point Bend) Measure Adhesion Forces Quantitatively
FSM Laminar Measure Adhesion Forces Qualitatively