COMET AG

Synertia® allows to manage the complexities of multi-layer next-generation memory and atomic-scale plasma processes. The unique, patented controls of Generator and Matching Network interact at highest possible speeds. These actionable insights enable more complex plasma applications than have ever been possible before.

RF Power Generator Synertia® RFG

Users fully control the unique performance accelerators of Synertia® RF generators, including:

• Multilevel pulsing that is tunable and highly configurable to deliver precise and repeatable control of the plasma.
• Consistent performance over millions of process steps.
• Advanced visualization of critical measurement and control parameters. This enables acceleration of process optimization and speeds time to solution. A wide variety of smart data sets for debugging, troubleshooting, and targeted analytics.

Higher yield is the result of Synertia®’s fast and agile process control, which delivers superior repeatability, faster tuning, and custom wave-shaping.

CA20 highlights

• Designed for the semiconductor industry
• Non-destructive technology for three-dimensional insights into solder bumps within minutes
• Repeatable results through reliable and accurate technology, designed to support a stable inspection routine
• Efficient software-assisted review including automated void analysis with Void Insights
• Dose Manager for the protection of X-ray sensitive components

CA20 – The fastest way from R&D to ROI
The semiconductor sector is a speed-driven industry. In the race for innovation every day counts. As an inspection system specifically developed for the challenges of complex 3D ICs in Advanced Packaging, the CA20 helps you keep the pace – and to stay ahead of the game. The CA20 enables an accelerated verification of new packaging process node prototypes: The faster you find the root cause of ramp-up issues and fix them, the faster you’ll reach the desired yield – and, thus, the Return-on-Invest (ROI).

Speed up your process development with 3D X-ray
While inspections using destructive methods can take weeks, 3D X-ray gives your R&D engineers results they can work with right away. As a non-destructive testing (NDT) system, the CA20 supplies you with crystal-clear 3-dimensional images of nano details inside your ICs within minutes. Monitor your interconnects process, find flaws fast and feed your insights back into the process.

The FXE series is designed for non-destructive quality assurance, off-line inspection, and measurements of parts with defects in the low micrometer range.
The microfocus and nanofocus resolution x-ray modules allow clear feature recognition in various applications: 

• Electronics inspection
• Soldering joints on circuit boards – PCBA
• Ball grid arrays – BGA
• Integrated circuits – IC
• Bonding wires
• Semiconductor packaging and interconnects
• Wafer-level chip-scale packages
• Microelectromechanical systems - MEMS

Unlimited lifetime
Our modular design facilitates the quick replacement of critical parts, making the FXE’s total cost of ownership among the lowest in its class. You’ll never have to worry about running the tube at its limit, as you can always replace the wear-parts; the tube is designed to last well beyond the expected life cycle of any systems it’s integrated into.

Benefit from the stability, brightness, and sharpness of our FXE modules by combining it with a high-performing X-ray detector to experience superior image quality and in-depth nanoscale analysis.