ClassOne Technology

Kalispell,  MT 
United States
http://www.ClassOne.com
  • Booth: 1453

Welcome to ClassOne Technology!

Overview

Headquartered in Kalispell, Montana, ClassOne Technology has become a preferred provider of advanced wet-chemical wafer processing equipment for ≤200mm semiconductor wafers. The Solstice® series provides high-performance single-wafer electrochemical deposition (ECD) and wafer surface preparation processes. The Solstice platform is available in hardware configurations with two to eight processing chambers to cover process development as well as low-, medium-, and high-volume production. The Trident™ series provides an array of high-efficiency, highly dependable spin-rinse-dryers and spray solvent tools for batch-processing. The company brings high-performance processing technology to compound semiconductor and other key markets, including photonics, power, 5G, microLED and MEMS. Hundreds of ClassOne tools are presently in use building leading-edge devices in major fabs and research facilities around the world.

  Press Releases

  • Kalispell, MT — 

    ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, and Porotech, a pioneer in gallium nitride (GaN)-based semiconductor technology and a global fabless microLED provider, today announced that Porotech has selected the ClassOne Solstice® single-wafer platform for the development and manufacture of GaN products for applications requiring silicon wafer substrates.

    The devices being developed by Porotech target ultra-high-density and energy-efficient microLED microdisplays for augmented reality (AR) applications, wearables, and smart devices. To pursue these microLED applications, Porotech is leveraging its proprietary paradigm-shift technologies: its PoroGaN® GaN-on-silicon materials platform and Dynamic Pixel Tuning® (DPT®) microLED-on-silicon (µLEDoS) technology, which can be engineered to produce light at wavelengths across the visible spectrum.

    “Porotech is tackling mass-production challenges with partners in the µLEDoS supply chain, integrating wafer manufacturing, hybrid bonding, IC design, packaging, and assembly solutions. ClassOne’s Solstice plating technology provides a reliable and efficient foundation for the development of key process steps that will support the route to improved yields through utilization of larger silicon wafer sizes,” said Porotech CEO Tongtong Zhu. “We look forward to working with the team at ClassOne to bring the industry-leading performance benefits of PoroGaN and DPT to display applications in the next few years.”

    ClassOne Technology CEO Byron Exarcos stated, “As a leading provider of plating equipment for microLEDs, we’re excited to participate in the development and growth of Porotech’s breakthrough, game-changing microLED technology and to help drive these solutions toward mass production and high-volume manufacturing.”

    The Solstice single-wafer platform can combine multiple process technologies and chemistries in a single, small-footprint configuration for advanced chip packaging and surface preparation applications. Available with up to 3, 4 or 8 chambers, the scalable Solstice platform is suitable for both R&D and high-volume manufacturing environments, delivering ultimate wafer uniformity and process control. The system can also accommodate a wide variety of substrates, from traditional silicon devices to compound semiconductors and emerging materials such as glass.

    Learn more about ClassOne’s complete Solstice single-wafer platform offerings here, or click here to request a demo.

     

    About ClassOne Technology

    ClassOne Technology is a leading provider of advanced electroplating and wet processing systems for semiconductor and microelectronic device manufacturing around the world. Its advanced IP portfolio comprises highly customized, cost-effective processing solutions for critical wafer processes used to manufacture compound semiconductor devices for photonics, power, 5G, microLED, and MEMS and sensor markets. With tools installed in leading-edge fabs and research organizations worldwide, ClassOne’s flagship Solsticeâ platform is highly configurable, comprising fully and semi-automated electroplating and wet processing applications with the industry’s most competitive ROI. For more information, please visit classone.com.

    Stay in touch with us. LinkedIn | Twitter

    About Porotech

    Porotech Technologies Ltd. is a trailblazer in microLED and gallium nitride (GaN) material technology, headquartered in Cambridge (UK), with an R&D Centre in Hsinchu (Taiwan) and sales office in Chandler, Arizona (USA). Focused on pioneering advancements in display technology, Porotech’s pioneering PoroGaN® platform drives the development of ultra-small and efficient microLED chips. These chips are capable of emitting the full visible spectrum of colours using a single GaN material system. The company’s breakthrough Dynamic Pixel Tuning® (DPT®) technology further enhances display capabilities, enabling microLED pixels to emit any visible colour at specific current densities. Porotech is committed to shaping the future of displays, offering unmatched brightness, energy efficiency, and vibrant colour solutions.  For more information, please visit: www.porotech.com.

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  • Kalispell, MT — 

    ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today announced that leading European research institution VTT Technical Research Centre of Finland has placed its first order for a ClassOne Solstice® S8 single-wafer system. VTT will leverage the tool’s production-proven electroplating capabilities to perform advanced through-silicon via (TSV) processes for a range of applications, from MEMS packaging to 3D integration of novel sensor chips and quantum computing.

    This SEM image shows a high-aspect-ratio through-silicon via (TSV) filled using a Solstice S8 CopperMax single-wafer processing system from ClassOne Technology. VTT Technical Research Centre of Finland has purchased a Solstice S8 for copper TSV plating applications.

    According to industry research firm Yole Group, the advanced packaging (AP) sector is expected to realize a compound annual growth rate of 10% between 2022 and 2028, exceeding US$78 billion by 2028.​ Primary market drivers are shifting, as mobile and consumer decrease share while automotive and telecoms gain. Dominant packaging technologies flip-chip, 2.5D/3D and system-in-package (SiP) are expected to represent 90% of the AP market by 2028.

    VTT will use the Solstice system to add new copper TSV capabilities, enabling utilization of advanced electrolyte chemistries, and atomic layer deposition (ALD) seed layers for bottom-up TSV plating. “VTT has traditionally been focused on high-density bumps for detectors and basic packaging applications. As we turn our efforts toward advanced packaging, we seek to develop contemporary solutions for critical TSV and damascene processes,” said James Dekker, senior MEMS research scientist with VTT. “The Solstice system from ClassOne is vital to our work in these applications, which have been heretofore impossible to approach reliably.”

    The Solstice single-wafer platform can combine multiple process technologies and chemistries in a single, small-footprint configuration for advanced chip packaging applications. VTT’s Solstice S8 system chambers will include Vacuum Prewet for high-aspect-ratio features; CopperMax™ and Copper Gen4 ECD for plating; and spin-rinse-dry (SRD) for clean, fast wafer drying post-plating.

    Noted ClassOne Technology CEO Byron Exarcos, “We welcome VTT as a new customer for our Solstice platform. We’re seeing heightened interest in advanced packaging technologies from institutions and universities, and Solstice is perfectly poised to help them make the leap to single-wafer from batch processing. The work that VTT and other organizations are pursuing is vital to developing new capabilities that will impact the future of microelectronics manufacturing.”

    The Solstice platform’s flexible operation combines automation with manual operation, making the tool attractive for both R&D and pilot-line use, both of which VTT will use the tool to pursue. In addition, the firm plans to provide access to the tool for qualified customers needing Solstice’s unmatched capabilities to help advance their production efforts. ClassOne will ship the Solstice S8 to VTT’s head facility in Espoo, Finland.

  • Kalispell, MT — 

    Order for multi-chamber Solstice® GoldPro™ electroplating system selected for superior process and performance in high-volume manufacturing of microLED devices

    ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today announced it has received a follow-on order for its Solstice® GoldPro™ gold electroplating system from a leading microLED maker with global manufacturing sites. Built on ClassOne’s state-of-the-art Solstice platform, the system will be used at the customer’s new manufacturing site in Asia for high-volume production of next-generation microLEDs deployed in a range of end applications.

    ClassOne’s Solstice S8 system features the company’s proprietary GoldPro plating reactor. Designed to provide efficiency, speed, and improved cost of ownership, GoldPro leverages ClassOne’s unique fluid motion profile technology to deliver high plating rates and industry-leading plating feature uniformity. The Solstice S8 is on target to ship for installation in the second quarter of 2023.

    “Its latest order is evidence of our customer’s success with its existing base of tools, pointing up a significant partnership between ClassOne Technology and this major microLED player,” stated John Voltz, senior vice president of global business operations for the company. “This customer views the Solstice platform’s capabilities as key to accelerating market-readiness for its devices, further validating our world-class single-wafer processing capability and technology leadership in the microLED space.”

    According to Allied Market Research, the global microLED market is projected to reach US$23 billion by 2030, gaining ground over OLEDs by delivering improvements in brightness, contrast and energy savings. As a leading provider of plating equipment for microLEDs, ClassOne is well positioned to take advantage of this growth given Solstice’s high plating rates and throughput, strong customer base, and the addition of surface preparation processes to the platform’s already robust capabilities.

    Available with up to 3, 4 or 8 chambers, the scalable Solstice platform is suitable for both R&D and high-volume manufacturing environments, delivering ultimate wafer uniformity and process control. The system can also accommodate a wide variety of substrates, from traditional silicon devices to compound semiconductors and emerging materials like glass.

    Learn more about ClassOne’s complete Solstice single-wafer platform offerings here, or click here to request a demo.

    About ClassOne Technology
    ClassOne Technology is a leading provider of advanced electroplating and wet processing systems for semiconductor and microelectronic device manufacturing around the world. Its advanced IP portfolio comprises highly customized, cost-effective processing solutions for critical wafer processes used to manufacture compound semiconductor devices for the photonics, power, 5G, microLED, and MEMS and sensor markets. With tools installed in leading-edge fabs and research organizations worldwide, ClassOne’s flagship Solstice platform is highly configurable, comprising fully and semi-automated electroplating and wet processing applications with the industry’s most competitive ROI. For more information, please visit classone.com.

    Stay in touch with us. LinkedIn | Twitter

  Products

  • Solstice® S8
    Advanced single-wafer electroplating and surface preparation, with up to eight chambers....

    • Solstice® S8

    Advanced single-wafer electroplating and surface preparation, with up to eight chambers

    Key Benefits:

    • Ideal for high- volume processing
    • High plating rates, excellent throughput
    • Exceptional quality plating and surface prep
    • Special processing chambers can substantially reduce plating costs
    • Superior process control and excellent uniformity

    The Solstice® S8 is the most powerful, easy-to-use, and cost-efficient route to single-wafer volume production for many applications. The fully automated chamber tool is designed for advanced wafer surface preparation and electroplating.

    The S8 is engineered to deliver class-leading performance and exceptional operational flexibility. Its unique platform enables it to handle a spectrum of wet processes, from electroplating to high-pressure metal lift-off (MLO) to UBM etch and much more. The system is designed to accommodate many different substrate types, both transparent and opaque, from ultra thin to bonded. With its ability to deliver high-quality plating of a wide range of metals, the Solstice S8 can significantly reduce plating costs.

    Solstice gives wet bench users an attractive, affordable, and easy upgrade path to the benefits of high-speed, cassette-to-cassette automated processing. The eight chambers of this system may be configured with a mix of different plating and surface prep chambers: GoldPro, CopperMax, Wet Etch, MLO, and Advanced Packaging.

  • Solstice® S4
    Advanced, single-wafer, high-throughput ECD and surface preparation, with up to four chambers. ...

    • Solstice® S4

    Advanced, single-wafer, high-throughput ECD and surface preparation, with up to four chambers

    Key Benefits:

    • Ideal for mid-level volume processing
    • Smaller footprint and lower cost than Solstice S8
    • High plating rates, excellent throughput
    • Exceptional quality plating and surface prep
    • Special processing chambers can substantially reduce plating costs
    • Superior process control and excellent uniformity

    The Solstice® S4 automated electroplating systems are high-speed, fully -automated, 4-chamber tool designed for electroplating as well as surface preparation wet processing. The S4 provides all the essential features and capabilities of the S8, but with fewer chambers, a smaller footprint, and a lower price. The S4 can be ideal for users with simpler processing needs or who require an economical entry point into mid-level automated single-wafer electroplating production with enhanced process control.

    The Solstice S4’s four chambers may be configured with a mix of different plating and surface prep chambers: GoldPro, CopperMax, Wet Etch, MLO, and Advanced Packaging.

  • Solstice LT
    Semi-automated single-wafer process development with up to three chambers....

    • Solstice® LT

    Semi-automated single-wafer process development with up to three chambers

    • Ideal for low-volume, R&D processing
    • Economical entry to single-wafer processing
    • Improved process quality and consistency
    • Easy scale-up path to automated production
    • Smallest Solstice system footprint

    The Solstice® LT a full-featured, easy-to-use for electroplating and surface preparation application, can process a broad range of wafer sizes down to 75mm. In addition to electroplating, the system can perform high-pressure metal lift-off (MLO) spray acid applications such as UBM etch, and more. The LT accommodates up to three chambers for manual-load, semi-automated process development, or low-volume or R&D production. The systems use the same software and controls, and the same selection of chambers as the Solstice S4 and S8 configurations, providing an easy scale-up to automated production as capacity need expand.

    The Solstice LT system chambers may be configured with a mix of different plating and surface prep chambers, including: GoldPro, CopperMax, Wet Etch, MLO, and Advanced Packaging.

Categories

207 Process Equipment
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Deposition; (CVD, PVD, ALD, Plating)
  • Etching; Stripping; Ashing - Dry and Wet Equipment
  • Plating; Electro Chemical Plating; Deposition Systems

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