Contributing to the device industry through high productivity, a small footprint, improved ease of maintenance and operability plus eco- friendly processing to support GX.
RF-200EX and 300EX inherit a wealth of advanced coat/develop track technologies refined by SCREEN SPE over many years and deliver both outstanding productivity and a smaller footprint. They are also distinctly more environmentally friendly, dramatically reducing resist consumption during wafer coating and electricity consumption throughout the manufacturing process.
RF-200EX: Expendability and flexibility to handle both legacy processes and DUV processes. A new 300mm technology is redeployed to a 150mm to 200 mm dedicated small wafer size platform
RF-300EX: For thin wafers and handles a broad range of chemical solutions for resist, polyimide, SOC and other applications