联盛半导体科技（无锡）有限公司

http://www.zglsee.com
  • Booth: 4127

Overview

联盛半导体科技有限公司成立于2023年 5月，是山东联盛电子设备有限公司的全资子公司，工厂地址位于江苏省无锡市锡山科创园，公司致力于半导体高端湿制程设备研发、生产与销售。

山东联盛电子设备有限公司目前已申请国家专利30 多项，其中发明专利9项，是国家高新技术企业，省级专精特新企业，公司于2016 年申请并通过ISO9001质量体系认证。并于 2020 年、2022年分别和山东大学微电子学院，青岛大学电子信息工程学院建立产学研合作，同时总经理马玉水被青岛大学聘为创新创业导师。

我们产品服务的领域包括硅材料、化合物半导体材料等，主要设备有:全自动 RCA清洗机、全自动镀镍镀金清洗机、全自动最终清洗机、全自动腐蚀减薄清洗机、全自动去边清洗机、全自动沟槽蚀刻机、全自动二氧化硅蚀刻机、炉管清洗机、CVD 前清 洗机、CDS(SDS) 系统、BClean、Oxide Remove、Nitride Remove、PR Strip、Lift Off、Particle Remove.Solvent Clean、MetalEtch、M2 Clean.

Liansheng Semiconductor Technology Co., Ltd. was established in May 2023, is a wholly-owned subsidiary of Shandong Liansheng Electronic Equipment Co.,Ltd. and the factory address is located in Xishan Science and Technology Park, Wuxi City,Jiangsu Province, the company is committed to the research and development of semiconductor high-end wet process equipment, production and sales.

Shandong Liansheng Electronic Equipment Co., Ltd. has applied for more than 30 national patents, including 9 invention patents, is a national high-tech enterprises, provincial speciality and new enterprises, the company applied for and passed ISO9001 quality system certification in 2016.And in 2020, 2022 and Shandong University Microelectronics College,Qingdao University

School of Electronic Information Engineering to establish production, learning and research co-operation, at the same time, the general manager Ma Yushui was appointed by Qingdao University as an innovation and entrepreneurship tutor.

Our products and services in the field of silicon materials, compound semiconductor materials, etc., the main equipment are: Automatic RCA cleaning machine,Automatic nickel-plated gold cleaning machine,Automatic final cleaning machine, Automatic corrosion thinning cleaning machine, Automatic de-edge cleaning machine, Automatic trench etching machine, Automatic silicon dioxide etching machine, Furnace tube cleaning machine, CVD pre-cleaning machine, CDS (SDS),BClean, Oxide Remove, Nitride Remove,PR Strip, Lift Off, Particle Remove, Solvent Clean, Metal Etch, M2 Clean.

  Products

  • Automatic etching machine
    Processing capability: Wafer diameters range from 4 inch to 12 inch, 75 pcs for wafers with 6 inches, or 50 pcs for wafers with 8 inches and 12 inches at a time....

    • 1、Wafer immersion etching and cleaning, with wafers automatic rotation and lifting in the special rotating cage.
    2、The process results are highly uniform and consistent, ensuring etching effectiveness.
    3、Nitrogen blowing function allows the nitrogen pipeline to move parallel and evenly in the acid tank during
    operation, and the blowing rate can be adjusted.
    4、Multi-stage fine filtration, with recycling function and automatic replenishment of chemical liquid.
    5、Equipped with the ability to interact and communicate with information from the MES system.
    6、Chemical solutions are equipped with the InLine heating, cooling and thermostat functions.
    7、Standardized process solutions are provided.
    8、Etching accuracy: flatness increment TTV≤1.5μm.
    9、Processing capability: Wafer diameters range from 4 inch to 12 inch, 75 pcs for wafers with 6 inches, or 50 pcs
    for wafers with 8 inches and 12 inches at a time.
    10、The equipment has applied for one invention patent and two utility model patents.
  • Single wafer cleaner
    Used for single wafer etching, cleaning and brushing process of semiconductor materials such as Si, SiC, GaN and so on....

    • 1、Used for single wafer etching, cleaning and brushing process of semiconductor materials such as Si, SiC, GaN and so on.
    2、Multi-size compatibility can be achieved (4&6 inch; 6&8 inch; 8&12 inch).
    3、The process chamber is optimised design, high-performance FFU, with adjustable height of the CUP, forming a stable strength of the downflow, strict control of the wafer surface process area of the dynamic environment.
    4、It can implement the separation of liquid (acid/alkali/organic), no cross-pollution of liquid.
    5、Can be applied to substrate and epitaxial cleaning, PRstrip, Oxide removal and other processes.
    6、Support GEM/SECS agreement, support MES system on-line.

產品種類

207 Equipment, Process
  • Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
  • Etching; Stripping; Ashing - Dry and Wet Equipment
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