Workshop of Photonics

Mokslininku str. 6a
Vilnius,  LT-08412

Lithuania
https://wophotonics.com
  • Booth: B1566


Micron-scale solutions for the Semiconductors Industry.

WOP provides laser processing solutions and technologies from prototyping and small to medium scale production to laser system development.

Here we present our femtosecond laser processing capabilities to provide glass carrier wafers, spacers, interposers, TGV wafers, ceramic or glass plates for probe cards.

Our patented glass & sapphire processing technology allows ultra-fast, up to 200 times faster, glass micro-processing using femtosecond lasers and chemical etching. It ensures ultra-high precision and cost-effective results.

We work with all materials - GLASS, SAPPHIRE, SILICON, CERAMICS, METAL, PLASTIC, OPTICAL FIBERS, etc.

So if you have a micron-scale task – contact us at [email protected]. Our team will deliver a solution.

Rapid prototyping services: https://wophotonics.com/services/prototyping/

Production services from 1 unit: https://wophotonics.com/services/

Laser system development: https://wophotonics.com/products/#laser-machines 


 Products

  • Guide Plates for Probe Cards
    CERAMIC and GLASS plates manufacturing services. Ultra-high precision, rapid prototyping, small feature sizes, heat, and force resistance....

  • WOP delivers Ceramic Plates and Glass Plates for the probe cards industry – an essential component for guiding probes for microchip inspection at the correct position.

    We offer rapid prototyping and production services from 1 unit for your individual designs.

    We offer industry-leading processing technology and experience, that ensure feature size minimization at the ultra-high quality level. 

    Features:

    • Circular, square, and other-shaped holes
    • Straight hole cross-section | no taper
    • Low chipping <10 μm
    • Smooth sidewalls, Ra <1 μm
    • Typical min. hole size 20 µm (circular)
    • Positional accuracy ±3 µm
    • Aspect ratio up to 1:100
    • High throughput and yield
    • Minimal or no post-processing is needed


    https://wophotonics.com/services/guide-plates-probe-cards/

  • Glass Spacers Interposers
    WOP offers high surface quality glass wafers densely packed through holes that require none or minimum post-processing before being used in your production process....

  • Our produced Glass Spacers (Interposers) are suitable for 2.5D / 3D integration and wafer-level bonding with semiconductor substrates for MEMS, sensors, analytical chips, or other functional devices.

    WOP offers high surface quality glass wafers densely packed through holes that require none or minimum post-processing before being used in your production process.

    We offer fast prototyping and production from 1 unit for your individual designs.

    We ensure:

    • Ultra-high precision and quality
    • Various types of glass
    • Small feature sizes
    • High aspect ratios unachievable with alternative technologies

    Typical features:

    • A variety of glass types and major suppliers – Corning, Schott, Hoya, AGC
    • Wafer size up to 200 mm x 200 mm (8”)
    • Wafer thickness from 30 µm to 10 mm
    • Circular, square, and other-shaped holes
    • Straight hole cross-section | no taper
    • Low chipping <10 μm, typ. none
    • Smooth sidewalls, Ra <1 μm
    • Typical min. hole size 20 µm (round)
    • Positional accuracy ±3 μm
    • No debris on back and front surfaces
    • No sagging around holes
    • Aspect ratio up to 1:100
    • High throughput and yield
    • Ability to work with metalized glass types (e.g. Au, Pt, Ni, Cr, Mo)


    https://wophotonics.com/services/glass-spacers-interposers/

  • Glass Carrier Wafers
    Glass Carrier Wafers production services. Our ability to densely pack tens and hundreds of thousands of through holes in glass wafers allows us to offer price-effective carrier wafers for convenient handling and release processes....

  • Glass Carrier Wafers production services. Our ability to densely pack tens and hundreds of thousands of through holes in glass wafers allows us to offer price-effective carrier wafers for convenient handling and release processes.

    We offer fast prototyping and production services from 1 unit.

    Depending on your needs we offer alkali and alkali-free perforated re-usable glass carriers which are custom made according to your design.

    A straight cross-section of the hole enables us to combine more holes than are possible with other technologies and combine large through-holes with narrow channels at the same time.

    We ensure:

    • Ultra-high precision and quality
    • Various types of glass
    • Small feature sizes
    • High aspect ratios unachievable with alternative technologies

    Typical features:

    • A variety of glass types and major suppliers – Corning, Schott, Hoya, AGC
    • Wafer size up to 200 mm x 200 mm (8”)
    • Wafer thickness from 30 µm to 10 mm
    • Circular, square, and other-shaped holes
    • Straight hole cross-section | no taper
    • Low chipping <10 μm, typ. none
    • Smooth sidewalls, Ra <1 μm
    • Typical min. hole size 20 µm (round)
    • Positional accuracy ±3 μm
    • No debris on back and front surfaces
    • No sagging around holes
    • Aspect ratio up to 1:100
    • High throughput and yield
    • Ability to work with metalized glass types (e.g. Au, Pt, Ni, Cr, Mo)
    • Minimal or no post-processing is needed


    https://wophotonics.com/services/glass-carrier-wafers/

  • Rapid Prototyping Services
    We deliver rapid prototyping services in order to turn your idea into reality quickly and efficiently. Owning 18 years of experience in femtosecond laser micromachining, we’ve accumulated significant know-how in the field....

  • The objective of a feasibility study is to demonstrate, our customer’s tasks can be solved using ultrashort pulse laser micromachining. And prove it is more advantageous over competing technologies.

    Feasibility studies are followed by prototype production and series production.

    If you need one or ten items for experimentation or hundreds for trials or validation, Workshop of Photonics will help. All production and handling services are performed in our lab and cleanroom facilities. All are fabricated in-house and ensures faster processes also our client’s project protection.

    Our experienced team, using advanced WOP technologies and a fully equipped laboratory, will deliver a solution for you and ensure ultra-high quality results.

    https://wophotonics.com/services/prototyping/ 

  • Production Services
    Small to medium scale production services from 1 unit. Variety of materials: Glass, Ceramics, Silicon, Sapphire, Metal, Plastic, Optical fibers....

  • Small to medium scale production services from 1 unit. Variety of materials: Glass, Ceramics, Silicon, Sapphire, Metal, Plastic, Optical fibers.

    Name your micron-scale task and we will deliver a solution.

    Portfolio: https://wophotonics.com/services/

  • Laser System Development
    Tailor-made femtosecond laser systems development for your specific applications....

  • Tailor-made femtosecond laser systems development for your specific applications.

    Portfolio: https://wophotonics.com/products/#laser-machines


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