131 Impasse Barteudet
Saint Jeoire,  F-74490

  • Booth: B1112

Develop the chips of the future with SET flip-chip bonders.

Founded in 1975, based in France, SET is a world leading supplier of high accuracy flip-chip bonders (chip-to-chip and chip-to-wafer) and versatile NanoImprint Lithography (NIL) solutions.

With equipment installed worldwide, SET is globally renowned for the unsurpassed accuracy and the flexibility of its flip-chip bonders.

Ranging from manual loading to fully automated version, the SET bonders adapt to all main bonding techniques: fluxless reflow, thermo-compression, adhesive joining compression, thermosonic…

SET offers a comprehensive product portfolio of flip-chip bonders for fast growing markets and serving clients through a global network of representatives and in-depth customer trainings.

Visit SET website for more information:

 Press Releases

  • SUSS MicroTec and SET announce a partnership in sequential die-to-wafer (D2W) hybrid bonding, a die-based interconnect technology, to provide a fully automated, customizable, highest-yield equipment to customers. This solution will accelerate the industry’s path towards advanced 3D multi-die solutions such as stacked memory and chiplet integration.

    Saint-Jeoire, France and Garching, Germany - September 1st, 2021 - SUSS MicroTec -leading supplier of equipment and process solutions for the semiconductor industry- and SET -leading supplier of high precision flip-chip bonders- signed a joint development agreement to develop a cluster, including several modules such as surface preparation, cleaning, bonding and metrology.

    As part of this partnership, SUSS MicroTec’s high-efficiency surface preparation modules and throughput-optimized metrology solutions for post bond overlay verification will be combined with SET’s latest ultra-high accuracy D2W hybrid bonding platform.

    As today’s 2.5D and 3D packaging schemes are limited by the minimum interconnect density that traditional microbump technology can offer, hybrid bonding solves this problem by bonding the direct contact between two metal pads (mostly copper) and surrounding dielectrics in one single bonding step. This bumpless bonding approach allows for substantially smaller pitches and higher interconnect density which are the key enablers for future generations of multi-die solutions.

    Goetz M. Bendele, PhD, CEO of SUSS MicroTec:

    "Hybrid bonding is one of the main growth drivers of the advanced semiconductor backend equipment space, as well as one of the main growth levers for SUSS MicroTec. With our partnership with SET, we will be able to offer our customers a complete suite of both die-to-wafer and wafer-to-wafer hybrid bonding solutions for the broadest set of heterogeneous integration applications in the advanced backend space. Our die-to-wafer bonding solution, leveraging the combination of SET’s leading-precision die placement technology with SÜSS’s proven surface activation, automation, and metrology capabilities, will deliver additional customer value through differentiation in terms of throughput and yield, while at the same time enabling friction-less integration into our customers’ fabrication sites.”

    Pascal Metzger, PhD, CEO of SET:

    “Thanks to several partnerships we had & our more than 10 years experience in hybrid bonding, we have succeeded in taking hybrid bonding from a purely laboratory level (multi-partner project including CEA-Leti) to an industrial level (multi-partner project in the consortium IRT Nanoelec). Excellent technical results have been obtained and published in several conferences and industrial feasability has been demonstrated in CEA-Leti cleanrooms in Grenoble, France. Thus in September 2019, SET launched a stand-alone machine – the NEO HB. Thanks to our new partnership with SUSS MicroTec, we are now going to accelerate the integration and automation phase of the process. This will permit to provide a complete industrial solution to our customers, for applications coming in the very near future such as HPC (High Performance Computing), AI (Artificial Intelligence), 5G and many other more, to diversify our offer and address new market segments.”

    For more details on hybrid bonding at SUSS MicroTec and SET


  • ACCμRA M
    ± 3 μm post bond accuracy - Manual...

  • The ACCμRA M permits to align manually the components with a high level of precision.
    Its motorized arm controls precisely the bonding force.
    Combining and synchronizing automatically the force and the temperature, it guarantees a perfect quality and a high repeatability of your process.
  • ACCµRA100
    ± 0.5 μm post bond accuracy - High force: 1-1000 N...

  • The flexibility of the ACCμRA100 makes it ideal for developing a wide range of applications.
    Its motorized axes guarantee a high repeatability of your process.
    It combines high precision, accessibility and cost-effectiveness.
    ± 0.5 μm post bond accuracy - Low force: 0.2-10 N...

  • The ACCμRA OPTO is dedicated to optoelectronics and silicon photonics applications.
    Its motorized axes guarantee a high repeatability of your process.
    It combines high precision, accessibility and flexibility.
  • FC150
    1 μm post bond accuracy - From manual to automatic - From low to high force: 0.3-2000 N...

  • Historic machine of SET, the FC150 is present in laboratories all over the world. SET has been able to make it evolve technically over time.
    The FC150 is a high accuracy and versatile flip-chip bonder.
    It is designed for chip-to-chip (up to 100 mm) and chip-to-wafer (up to 200 mm) applications on the same open platform.
    It is an open platform with many features to cover a large range of applications from low to high forces.
  • FC300
    ± 0.5 μm post bond accuracy - Automatic - High force: 1-4000 N...

  • Dedicated to very fine pitches (< 10 μm), the FC300 is designed for chip-to-chip (up to 100 mm) and chip-to-wafer (up to 300 mm) applications.
    It combines very high force and high temperature with very high accuracy on large samples, all of them at the same time.

Send Email

Type your information and click "Send Email" to send an email to this exhibitor. To return to the previous screen without saving, click "Reset".