Park Systems Europe GmbH

The automated Atomic Force Microscopy (AFM) system for ultra large and heavy flat panel displays at nanoscale

As the demand for Atomic Force Metrology for larger flat panel displays increases, Park NX-Tip Scan Head overcomes nanometrology challenges for samples over 300mm. The Tip Scanning Head (TSH) and gantry style air-bearing stage allows Park NX-TSH to accurately image roughness measurement, step height measurement, and critical dimension measurement.

The fully Automated Tip Scanning Head for OLED, LCD, and 2D encoder sample

• Tip Scanning Head in X, Y and Z directions, up to 100 µm x 100 μm (x-y direction) and 15 μm Z-direction
• Flexible chuck to accommodate large and heavy samples over 300mm and 1KG
• Long Range Air-bearing XY stage for AFM analysis of industrial samples larger than 300 mm
• 100 µm x 100 µm Flexure-Guided XY Scanner with Closed-loop Dual Servo System
• 15 µm High Speed Z Scanner with Low Noise Position Sensor
• Automatic Measurement Control and automated system features such as live monitoring of the measurement process, automatic analysis of acquired measurement data, and more!

Park NX-3DM

Park Systems has introduced the revolutionary Park 3DM Series, the completely automated AFM system designed for overhang profiles, high-resolution sidewall imaging, and critical angle measurements.

A fully automated industrial AFM using NX technology

• NX technology automatically constructs an extremely accurate topographical image and collects essential dimensional data
• The low noise Z-detector works on an independent, closed loop to minimize errors in topography
• True Non-contact™ mode allow for the collection of high resolution and accurate data without tip-sample damage

Innovative head design for undercut and overhang structures

• Patented decoupled XY and Z scanning systems work together with the tilted Z-scanner, letting users overcome normal challenges in accurate sidewall analysis associated with normal and flare tip methods
• Z-head tilting mechanism allows access to the sidewalls using an ultra-sharp tip to obtain the same high resolution and definition as is obtained over the rest of the material

A Reliable, Seamless Measurement Tool for 3D materials

• No sample preparation is required to obtain the sidewall roughness or critical dimension measurements in this process
• By utilizing Z-head tilting and True Non-contact™ mode, the NX-3DM allows for both tip-preserving and high-resolution collection of sidewall data
  
  Read more: https://parksystems.com/products/industrial-afm/park-nx-tsh/overview

Low noise Atomic Force Profiler for accurate, high throughput CMP profile measurements

Sub-Angstrom surface roughness measured with extreme accuracy and minimized tip-to-tip variation

Smart ADR Software

With Park's Smart ADR NX-Wafer provides fully automated defect review and identification, enabling a critical inline process to classify defect types and source their origin through high resolution 3D imaging.
Designed specifically for the semiconductor industry, Smart ADR is the most advanced defect review solution available, featuring automatic target positioning without the need for labor intensive reference marks that often damage the sample. The Smart ADR process improves productivity by up to 1,000% compared to traditional defect review methods. Additionally, the new ADR capability offers up to 20x longer tip life thanks to Park's groundbreaking True Non-Contact™ Mode AFM technology.

Inline Automation, for Fast, Accurate, and Repeatable PTR Measurements

The hard disk drive slider manufacturing industry demands a tool that provides fast, streamlined Pole Tip Recession Measurements while still maintaining the highest standard of accuracy available. It demands a tool like the Park NX-PTR. The NX-PTR offers extremely accurate PTR measurements to process engineers with inline automation that increases throughput. This makes it the perfect solution for HDD slider manufacturers looking to maximize their quality and production yield.

High Throughput, with No Need for Multiple Reference Scans

Our crosstalk eliminated scan system allows for truly flat scans, effectively eliminating the multi-scan process. In addition, True Non-Contact Mode™ preserves tip sharpness for prolonged high-resolution imaging and much longer tip life. This lets the Park NX-PTR generate accurate images of highly detailed regions of interest within larger macrostructures, without any need of reference scan to correct various scanner artifacts.

Park NX-HDM

Park NX-HDM is an AFM system that speeds up the defect review process by an order of magnitude through automated defect identification, scanning and analysis. It links directly with a wide range of optical inspection tools, thus significantly increasing the automatic defect review throughput.

Higher Throughput, Automatic Defect Review

The task of identifying nanoscale defects is a very time-consuming process for engineers working with media and flat substrates. Park NX-HDM is an atomic force microscopy system that speeds up the defect review process by an order of magnitude through automated defect identification, scanning and analysis. Park NX-HDM links directly with a wide range of optical inspection tools, thus significantly increasing the automatic defect review throughput.

Sub-Angstrom, Surface Roughness Measurement

Increasingly, industries require ultra-flat media and substrate to address the ever-shrinking device dimensions. Park NX-HDM provides accurate sub-angstrom surface roughness measurements, scan after scan. Park NX-HDM, together with its industry’s lowest noise floor, and its unique True Non-Contact™ technology, it is the most accurate AFM for surface roughness measurement in the market.

Park Systems has introduced the revolutionary Park 3DM Series, the completely automated AFM system designed for overhang profiles, high-resolution sidewall imaging, and critical angle measurements.

A fully automated industrial AFM using NX technology

• NX technology automatically constructs an extremely accurate topographical image and collects essential dimensional data
• The low noise Z-detector works on an independent, closed loop to minimize errors in topography
• True Non-contact™ mode allow for the collection of high resolution and accurate data without tip-sample damage

Innovative head design for undercut and overhang structures

• Patented decoupled XY and Z scanning systems work together with the tilted Z-scanner, letting users overcome normal challenges in accurate sidewall analysis associated with normal and flare tip methods
• Z-head tilting mechanism allows access to the sidewalls using an ultra-sharp tip to obtain the same high resolution and definition as is obtained over the rest of the material

A Reliable, Seamless Measurement Tool for 3D materials

• No sample preparation is required to obtain the sidewall roughness or critical dimension measurements in this process
• By utilizing Z-head tilting and True Non-contact™ mode, the NX-3DM allows for both tip-preserving and high-resolution collection of sidewall data

Park NX-HDM is an AFM system that speeds up the defect review process by an order of magnitude through automated defect identification, scanning and analysis. It links directly with a wide range of optical inspection tools, thus significantly increasing the automatic defect review throughput.

Higher Throughput, Automatic Defect Review

The task of identifying nanoscale defects is a very time-consuming process for engineers working with media and flat substrates. Park NX-HDM is an atomic force microscopy system that speeds up the defect review process by an order of magnitude through automated defect identification, scanning and analysis. Park NX-HDM links directly with a wide range of optical inspection tools, thus significantly increasing the automatic defect review throughput.

Sub-Angstrom, Surface Roughness Measurement

Increasingly, industries require ultra-flat media and substrate to address the ever-shrinking device dimensions. Park NX-HDM provides accurate sub-angstrom surface roughness measurements, scan after scan. Park NX-HDM, together with its industry’s lowest noise floor, and its unique True Non-Contact™ technology, it is the most accurate AFM for surface roughness measurement in the market.

As an FA engineer, you’re expected to deliver results. There’s no room for error in the data provided by your instruments. Park NX20, with its reputation as the world’s most accurate large sample AFM, is rated so highly in the semiconductor and hard disk industry for its data accuracy.

More powerful failure analysis solutions

Park NX20 is equipped with unique features that make it easier to uncover the reasons behind device failure and develop more creative solutions. Its unparalleled precision provides high resolution data that lets you focus on your work, while its True Non-Contact™ mode scan keeps tips sharper and longer, so you won’t have to waste as much time and money replacing them.

Easy to use, even for entry level engineers

Park NX20 has one of the most user-friendly designs and automated interfaces in the industry, so you won’t have to spend as much time and energy using the tool and supervising junior engineers with the system. This lets you focus your experience on solving bigger problems and providing insightful and timely failure analysis to your customers.