Georg-Kollmannsberger-Str. 3
Eching,  Bavaria  85386

  • Booth: B1413


cyberTECHNOLOGIES develops and manufactures high-end, non-contact 3D surface measurement systems for industrial and scientific applications.

The measurement systems are widely used in a multitude of applications in semiconductor industry, microelectronics and other precision industries including applications like flatness (i.e. BOW, WARP), total thickness variation (TTV), thickfilm/thinfilm, coplanarity (i.e. of bumps), roughness, lasermarking measurement and much more.

The 2D and 3D optical profilometer, along with the software, provides highly accurate and dependable readings. Major international companies, as well as many small and medium sized companies, trust in cyberTECHNOLOGIES solutions.

As a global player, cyberTECHNOLOGIES takes advantage of a worldwide network of qualified distributors, representatives and service partners.

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