S3 Alliance GmbH

Mahdenstr. 23
Kirchentellinsfurt,  72138

Germany
http://www.s3-alliance.com
  • Booth: B11003

S3 Alliance is a distribution company providing following products for the Semiconductor/MEMS market:

  • Equipment: new and remanufactured CMP, Backgrinding, Taping-Detaping-Mounting, Scribe and Break, ALD and Cleaning, Plasma Etch, RIE, ICP, Asher, Descuum, PECVD, Ultrasonic Spray Coating, Spin Coating, CPD (Critical Point Dryer).
  • Metrology and Automation: EFEM, Wafer Loaders, Flat/Notch Aligners, manual handling Tools, Thickness measurement, H2 Impurity Measurement, UV Lights, Ultrasonic Flow measurement, Scanning Electronic Microscope (SEM)
  • Parts & Consumables: Retaining Ring, Diamond Conditioners, CMP Pads, Grinding Wheels, Shipping boxes (new and reconditioned), Cassettes (PFA, PP, PE, PEEK), O-ring replacement for Kalrez; CMP Parts, Chamber Cleaning Materials, Chemical and DIW Heaters, Chemical Pumps.
  • Services: Robot repair for Yaskawa, Kawasaki, Brooks, PRI, Equip and Genmark. LFM repair Cryo Pumps repair and refurbishment, Power supply repair. Cleaning solutions: Cleaning pads and kits for all type of chambers, Microfiber wipers.
 

Categories

200 Packaging and Assembly Equipment
  • Backgrind; Slicing; Lapping; Polishing Equipment
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Device Handling; Feeding Systems
  • Dicing; Sawing; Scribing; Separation Equipment
  • Wafer Mount; Taping Equipment
    • 202 Other Equipment
  • Lamination; Sheet Laminating Equipment
  • Vibration Isolation Systems
    • 203 Inspection & Measurement Products
  • Film Thickness; Thickness; Uniformity Measurement; Ellipsometer
  • Flat; Notch Finding System
  • Microscopes: Confocal Scanning Microscope; 3-D Video Microscopes
  • Microscopes: SEM; Focused Ion Beam (FIB), TEM
  • Resistivity Measurement; 4 point probe; Sheet resistance
  • Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation
    • 204 MEMS Equipment
  • Deep RIE etching; Dry Etching
    • 206 PV Equipment
  • Inspection and Metrology
    • 207 Process Equipment
  • Chemical Mechanical Polishing (CMP); Electro Polishing, Mechanical Polishing Equipment
  • Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
  • Coat; Develop; Resist Processing; Track Equipment
  • Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD
  • Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment
  • Etching; Stripping; Ashing - Dry and Wet Equipment
    • 307 Process Materials
  • CMP; Grind; Lap; Polish; Abrasive materials
    • 308 Substrates
  • Silicon on Insulator (SOI); Silicon on Sapphire (SOS); Silicon Carbide;
    • 400 Components, Parts & Accessories
  • Chucks for Wafer and other Substrates
    • 401 Sub-systems
  • Power Supplies; RF Generators; Converters; Electrical Conditioning
  • Pumps, for Fluids
  • Ultrasonic Generators; Transducer and Monitoring Systems
    • 501 HVAC, Temperature, Humidity, Contamination Control
  • Contamination Control; HEPA Filtering Systems

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