SUSS MicroTec and SET announce a partnership in sequential die-to-wafer (D2W) hybrid bonding, a die-based interconnect technology, to provide a fully automated, customizable, highest-yield equipment to customers. This solution will accelerate the industry’s path towards advanced 3D multi-die solutions such as stacked memory and chiplet integration.
Saint-Jeoire, France and Garching, Germany - September 1st, 2021 - SUSS MicroTec -leading supplier of equipment and process solutions for the semiconductor industry- and SET -leading supplier of high precision flip-chip bonders- signed a joint development agreement to develop a cluster, including several modules such as surface preparation, cleaning, bonding and metrology.
As part of this partnership, SUSS MicroTec’s high-efficiency surface preparation modules and throughput-optimized metrology solutions for post bond overlay verification will be combined with SET’s latest ultra-high accuracy D2W hybrid bonding platform.
As today’s 2.5D and 3D packaging schemes are limited by the minimum interconnect density that traditional microbump technology can offer, hybrid bonding solves this problem by bonding the direct contact between two metal pads (mostly copper) and surrounding dielectrics in one single bonding step. This bumpless bonding approach allows for substantially smaller pitches and higher interconnect density which are the key enablers for future generations of multi-die solutions.
Goetz M. Bendele, PhD, CEO of SUSS MicroTec:
"Hybrid bonding is one of the main growth drivers of the advanced semiconductor backend equipment space, as well as one of the main growth levers for SUSS MicroTec. With our partnership with SET, we will be able to offer our customers a complete suite of both die-to-wafer and wafer-to-wafer hybrid bonding solutions for the broadest set of heterogeneous integration applications in the advanced backend space. Our die-to-wafer bonding solution, leveraging the combination of SET’s leading-precision die placement technology with SÜSS’s proven surface activation, automation, and metrology capabilities, will deliver additional customer value through differentiation in terms of throughput and yield, while at the same time enabling friction-less integration into our customers’ fabrication sites.”
Pascal Metzger, PhD, CEO of SET:
“Thanks to several partnerships we had & our more than 10 years experience in hybrid bonding, we have succeeded in taking hybrid bonding from a purely laboratory level (multi-partner project including CEA-Leti) to an industrial level (multi-partner project in the consortium IRT Nanoelec). Excellent technical results have been obtained and published in several conferences and industrial feasability has been demonstrated in CEA-Leti cleanrooms in Grenoble, France. Thus in September 2019, SET launched a stand-alone machine – the NEO HB. Thanks to our new partnership with SUSS MicroTec, we are now going to accelerate the integration and automation phase of the process. This will permit to provide a complete industrial solution to our customers, for applications coming in the very near future such as HPC (High Performance Computing), AI (Artificial Intelligence), 5G and many other more, to diversify our offer and address new market segments.”
For more details on hybrid bonding at SUSS MicroTec and SET
https://www.suss.com/hybrid-bonding
https://set-sas.fr/catalog/direct-bonding/