Industriestrasse 14
Darmstadt,  D-64297

  • Booth: B1221


  • EdgeScan
    EdgeScan reliably detects critical edge defects, and therefore, significantly minimizes wafer breakage during the polishing process....

  • The system detects defects such as chippings, cracks, scratches, or any residues at the wafer edge. Using just one camera, it creates a triple view of the edge, while simultaneously rotating and scanning the wafer.
  • WafQScan
    Precise defect detection and reliable quality classification for wafer surfaces...

  • Reliable wafer inspection in addition to standard AOI: Apart from typical metrology tasks, handling sequences and other processes can have a mechanical impact, causing a wide variety of scratches, debris, or even cracks that become the root cause of structural defects in processes.

    Based on line-scan cameras and illumination, WafQScan ensures 100% defect detection on the surface level of bare and processed wafer materials as well as diced wafers on tape with unique reliability and speed.
  • CrackScan
    Micro crack detection inside bulk wafer material...

  • The CrackScan optical inspection system precisely identifies tiny cracks inside a wafer. The high-speed line scan cameras reliably detect defects such as LLS, PID, or COP with the highest precision, even at maximum throughput rates.

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