3-1 Koudan-cho
Myoko City,  Niigata  944-0020

  • Booth: 216

Welcome to Our Low Temp. Assembly Technologies for FHE world

CONNECTEC JAPAN® specializes in semiconductor assembly business “OSRDA” (Outsourced Semiconductor Research, Development & Assembly), which provide clients a one-stop solution including substrate design, structure proposal, process development, proto-typing, evaluation, analysis and mass-production.

Our unique MonsterPAC® , Low-Temperature (down to 80 deg C), Low-load and Less-damage Flip Chip bonding and component assembly technologies will not only minimize harmful effects on subtle sensor chips or MEMS devices, but also make it possible to assemble such chips onto heat intolerant flexible substrates, including PET film and PU film.
We will also develop semiconductor related applications in cooperation with our partner companies.



    "Outsourced Semiconductor Research, Development & Assembly", We will support your requests on assembling ICs, MEMS, surface mounting, module prototyping, evaluation/analysis, reliability test, mass-production in cooperation with our partner companies....

  • OSRDA Development & Support: By connecting all the technologies of the Japan, which is the origin of our company name, We provide comprehensive support for semiconductor chip, not only MEMS chip, PCB mounting, module prototyping, sample prototyping, evaluation and analysis, reliability evaluation, and mass production. In cooperation with affiliated companies, research institutes, universities, etc., we provide services to meet your needs. >> Lean more about OSRDA >>

    Proto-typing Process Menu: Responding to all your requirement, Semiconductor chips and modules, ceramic, organic, film, etc., can be applied to various substrate materials. In addition to the process, we offer a variety of MonsterPAC menu, the process that best suits your needs and implementation structure.  >> Learn more about trial processes >>

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