AI Technology, Inc.

70 Washington Road
Princeton Junction,  NJ  08550

United States
  • Booth: 215

AIT provides leading edge solutions in electronic packaging with the use of advanced materials. Our profile includes:

  • Die Attach Films- high thermal conductivity, excellent flexibility, can be as thin as a few microns. electrically conductive or electrically insulating.
  • Temporary Bonding Solutions for the toughest wafer processing conditions as well as dicing and grinding
  • Stress-Free Adhesive Films and Pastes 
  • Conformal Coatings
  • TIMs 
  • Underfills
  • Encapsulants 
  • RF/EMI Shielding
  • Custom and Specialized Chemical, Adhesive, and Polymer Solutions

Our team of experienced scientists, engineers, and thermal management experts take pride in providing products that meet your needs!

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