systeMECH, Inc

2401 Crest Line Dr.
Madison,  WI  53704

United States
  • Booth: 210

Visit booth #210 to learn about our manufacturing technology

systeMECH, Inc has developed new approaches and tools to transform the manufacturing of a range of flexible micro- and nano­scale devices that incorporate high-performance semiconductors. Our novel direct die-placement (DDP) technology enables the manufacturing of next-generation flexible hybrid electronics through the transfer of thin and ultra-thin high-performance materials and devices to flexible and soft substrates. Our proprietary transfer technology was originally developed at the University of Wisconsin-Madison and systeMECH, Inc, was formed to commercialize the technology.

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