July 12-14, 2016
San Fransisco, CA
Visit booth #210 to learn about our manufacturing technology
systeMECH, Inc has developed new approaches and tools to transform the manufacturing of a range of flexible micro- and nanoscale devices that incorporate high-performance semiconductors. Our novel direct die-placement (DDP) technology enables the manufacturing of next-generation flexible hybrid electronics through the transfer of thin and ultra-thin high-performance materials and devices to flexible and soft substrates. Our proprietary transfer technology was originally developed at the University of Wisconsin-Madison and systeMECH, Inc, was formed to commercialize the technology.