MPI Cobra Probe Cards are a proven solution for a variety of semiconductor production tests including on wafer high volume manufacturing (HVM). Based on improved “Buckling Beam” technology – Cobra , the cards are adapted for bond pad patterns such as full array, semi-array, peripheral and staggered – chip pattern. MPI’s technology has the world best overall cost-of-ownership (COO) for the following DUT packages :
- Lead-free Bump
- Copper Pillar (Cu Pillar)
- Capped Pillar
- Aluminum Pad
MPI Cobra Probe Cards include high current carrying capability (CCC) and balanced contact force (BCF) . The technology is compatible with state-of-the-art space-transformer architectures. and is ready for applications requiring high signal integrity probing (SI) and/or power integrity probing (PI). Applications include cutting-edge SiPs/SoCs, WLP, graphic processors, microprocessor, industrial microcontrollers, and more.