QES (Singapore) Pte Ltd

  • Booth: 2738

QES was founded in Oct 1991. We specialise in manufacturing, distribution and provision of engineering services for inspection, test, measuring, analytical and automated handling equipment. QES Group of companies has since grown into a leading integrated solution provider with manufacturing capability.


  • Post Wire Bond Inspection System - PWB2000V
    High speed and high resolution vision inspection system, PWB2000V is automated, reliable and effective solution for post die attach and post wire bond inspection....

  • PWB2000V comes with the area scanning camera that capable to capture defects by using the 2D vision system. Integrated with programmable dual XY stage and on-the-fly scanning method, the system can accommodate multiple magazines at one time operation and eliminate the waiting time.

    Key Features

    • Auto 2D Vision Inspection Tool for 3rd Optical Application
    • Multiple Magazine Loader & Dual Scanning Track Mechanism
    • Capable to Store Maximum up to 5 Magazines (90mm Width Each)
    • Capable to Handle the Maximum Dimension of Sample up to 100mm (Width) x 300mm (Length)
    • High Resolution of Camera Up to 8.9MP  
    • Defect Classification based on 4 Vision Tools
    • Lighting Type of using Dome Light Ultra Bright for Stroboscope
    • On-the-Fly Vision Scanning with Stroboscopic Control
    • Programmable Recipe Control and Strip Mapping Capability
  • Wafer Packing & Unpacking System - WPS3800
    WPS3800 is designed to handle 8” & 12” Wafer size for packing & unpacking process from various type of shipping carriers....

  • The system comes with two load ports for 8” Semi Standard Open Cassette and 12” FOUP Cassette or 12” FOSB Cassette, two load ports for 8” Canister and 12” Canister (Configurable to 1x Canister and 1x Wafer Jar with optional cartesian robot module) and one port for interleaf paper (Auto-conversion for 8” and 12” wafers). WPS3800 comes with built-in vision sensor for wafer, interleaf paper or ring spacer detection and built-in height sensor on canister & wafer jar loading port for robot’s accuracy during pick and place process.

    Key Features

    • Comes with 2 x FOUP/FOSB for 12” Wafer and Open Cassette for 8” Wafer with Integrated Wafer Protrusion Detection Sensor and Thru-Beam Wafer Mapping
    • 2 x Universal Shipping Carrier Station for Various Type of Canister and Wafer Jar with Auto-Detection for 8” & 12” Wafer Size
    • 1 x Interleaf Paper Port (Auto-Conversion between 8” & 12” Paper)
    • Hirata 4-Axis ATM Robot with Flip Axis (Radius-Theta-Height-Flip Axes)
    • Built-in Vision System for Wafer, Interleaf Paper or Spacer Detection and Built-in Height Sensor for Robotic Handling Accuracy
    • Cartesian Robot Module for Wafer Jar Handling(Optional)
    • Wafer Ring Separator Handling Module for Canister (Optional)
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