Hero Fair Limited

Hong Kong
  • Booth: 3483


英展有限公司 (Hero Fair Limited) 自成立以来专注于半导体封装行业十九年!我们主要代理销售国外高端半导体封装设备如下:

德国HESSE键合机 | 以色列ADT切割系统 | 荷兰XYZTEC推拉力测试机 | 德国Alpha Plasma等离子清洗机 | 美国GPD点胶机  德国Budatec真空焊锡系统 | 韩国aLSR面激光选择性焊接机 | REB自动共晶机 | Astron LED UV解胶机

耗材供应:美国DeWeyl钢嘴 | ADT切割刀片等配件。


相约2019 Semicon China,期待与您相见!


Hero Fair have a strong sales and support network distributing semiconductor equipment and material in China market.

We are specializing in Wedge Bonding, Dicing, Ball Bonding, Die Bonding, Dispensing, Plasma Cleaning, Vacuum Soldering, Bond Tester and providing OEM automation solution. We supply consummable such as wedge and dicing blade.

This year we are promoting new product"Area Laser Selective Reflow(LSR)",is especially for Flex PCB application. Welcome to visit our booth, looking forward to seeing you soon!

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