HD335 is Mainly used in 8/12 inch wafers, integrated circuits, QFN, light-emitting diodes, LED chips, solar cells, electronic substrates, piezoelectric ceramics, etc.;
And products made in silicon, quartz, alumina, iron oxide, arsenic Gallium, lithium niobate, sapphire, glass and other materials are ideal work piece.
The main function configurations for HD335 are as followings:
1)Standard 1.8KW imported high-power air spindle and direct drive（DD）motor with high precision and fast speed（θaxis）；
2)Non-contact height measurement (NCS) and Blade breakage detection (BBD);
3)High-speed image recognition function and multiple alignment modes to quickly find the cutting path of processed objects, saving working time and greatly improving efficiency.