Shinkawa (Shanghai) Co., Ltd.

  • Booth: 3163

Bonding Microscopic Worlds, Creating Innovative Futures

Shinkawa Ltd. will exhibit two new models of wire bonder and die bonder.

· New  Wire Bonder UTC-5000 NeoCu Super,

· New Small Chip Die bonder STC-800 (Epoxy Version)

In addition, we will introduce S-CIM (Shinkawa Computer Integrated Manufacturing System), Intelligent Bonder, S-EC (Shinkawa Edge Computing) technology contributing to Smart Factory.

PFA Corporation, which newly joined to the Shinkawa Group in June last year, will introduce solutions related to mounting, assembly and inspection of various electronic components.

Moreover, Shinkawa Technologies will propose reuse and upgrade of existing Shinkawa products.


  • Wire Bonder, UTC-5000NeoCu Super
    High-speed wire bonder with new SimLoop function as standard capability...

  • Automatic optimization of loop shape with the newly designed loop shaping engine.

    Intuitive loop shape adjustment is possible by installing the loop display function.

    Loop templates can greatly reduce the settling time.

    Using overdrive function can increase the UPH by about 7%.

  • Die Bonder STC-800
    Small Chip Die Bonder STC-800 (Epoxy Version)...

  • An epoxy unit is mounted on Die Bonder STC-800 for small chip.

    Dual dispense head, realizing high productivity.

    Compatible with Lead Frame of size 100x300mm with the universal feeder.

    By installing a die back camera, further higher accuracy and versatile inspection functions can be achieved.

    Scheduled for possible conversion with the eutectic process.

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