Innovative Solutions to Test Chips in the Semiconductor Industry
Our long term experience in the electronic industry and our strong developing and process teams are inspired to create the future and to support the semiconductor industry. It is our passion to satisfy your demand as our customers with a comprehensive variety of solutions.
Vertical probe card with buckling beams for contacting on aluminum, copper, gold, palladium and other pads.
Contacting solutions for pads and copper pillars using solid MEMS beams.
Probe card with spring contact probes for WLCS P, SiP, analog and mixed signal flip chip applications.
Probe card with cobra like beams for testing of analog and mixed signal, flip chip and grid array solder bump applications.
Cantilever Probe Cards
Probe card with epoxy ring and needles for a wide range of applications.