TSE Co., Ltd.

Cheonan,  Chungnam 
Korea (South)
  • Booth: 4587

"Toward the Company Creating the Future Value of Technology"

As a Technoloby and Science Enabler in the field of Semiconductor Test and Display Test,TSE has developed the innovative technologies needed by its customers and has engaged in continuous research and productivity improvement activities. Founded in 1994,it has engaged as a leader in interface systems for Semiconductor Test.


  • Probe Card (HPC)
    HPC (High Performance Probe Card)...

  • > 1 Touch Down for 300mm wafer test
    > High parallelism test solution up to 1,500para
    > Pin count up to 35,000pins
    > Automatic Probe bonding
  • Load Board
    Load board is an interface board to test SOC package such as CPU, Chipset, GPU and AP. TSE is providing high speed, high performance load board to the major semiconductor customers like Intel, Samsung and AMD in worldwide......

  • > V93K 769BGA Dual Site Final Test Load Board (Picture)

    > ATE design library - V93K, T2000, Ultraflex, J750 and many more testers.

    > Accumulated PCB design know-how for 25 years and SI/PI simulation capability

    > TSE has owned PCB Fab and ass'y and test line in house.

    > TSE provides load board including stiffener frame and test socket as a turnkey solution.

  • TDMS-1000 / TDMS-2000
    HVM OS Test Monitoring & analytical instrument for Wafer Sort, Package Test and Strip Tset on Bumping or Wafer Level RDL non Visula defects....

  • TDMS-1000
    - Standard HVM OS Tester for Small Pin Count(512ch, 1024ch, 2048ch and 3072ch System)
    - 2 wire(non-Kelvin) structure
    - 1PMU covers 768ch
    - Other pin level setting except for test pin : OPEN/GND/VT1/VT2
    - Expansion slot(Option): DPS, LC, Vector Pattern
    - Domestic & International companies Qualified

    - Standard HVM OS tseter for High pin count (1024ch, 2048ch and 4096ch System)
    - Measure pin mode : 2 Wire normal mode / 4 wire Kelvin mode
    - Other pin level setting except for test pin : OPEN/GND
    - 1PMU covers 64ch
    - Max. 8192ch available
    - Expansion slot(Option): DPS, LC, Vector Pattern

  • 80um pitch TF MLO
    Fine pitch solution - C4 80um Pad (Bump) pitch. Mems Technology Thin film Stactup Process. Short delivery and Turn Key solutions for Vertical Probe card....

  • > C4 Pad Pitch  : 80um
    > Thickness : 1T // 1.5T // 2.5T
    > Layer : Thinfilm 3 layer + MLO 6 layers
    > Mems Technology Thin film Stackup process
    > Short delivery than conventional MLO 
    > TurnKey Solution (Design +PCB FAB+MLO FAB+Probe Card assembly)

  • Extreme Temperture TIB (Test Interface Board)
    Extreme Temperature TIB(Test Interface Board) TSE Interface board specialized in Extreme Temperature Package Test....

  • Extreme Temperature Test has been required in the Memory Test Envoironment.
    TSE has developed our own specialized Interface Board System for Extreme Temperature Pacakge Test.

     Extreme Temperature TIB(Test Interface Board)
      -. Extreme temperature Connector developed
      -. Docking Epoxy Frame Material developed
      -. Direct Cooling Interface Board developed
          > Coolant, Direct Active IC Cooling
          > Component Antioxidants
          > Temp. Reduced stabilization time

  • V93K Direct Docking Mems Probe card
    Improve CCC than conventional Cobra Probe! Good reliability probing planarity as Mems technology. Various Direct docking wafer probing solutions!...

  • > Probe : MEMS Cobra Pin (60x60um Cobra type)
    > Contact force : 1.2gF/mil
    > CCC : 950mA
    > Square hole type Housing (70x70um) 
    > Life time 1,5kk
    > Direct docking solution (V93K, Uflex)
    > Easy Replacement and Repair
    > Turn key Solution (PCB+MLO+Probe Head assembly)
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