Hamamatsu Corporation

Iwata-city,  Shizuoka 
  • Booth: T2122

The Wafer cutting samples are exhibited.

Hamamatsu Photonics, as a technological group of light, is pursuing the limit of light, carving out unexplored fields one after another, and we are taking an active part in a wide range of fields. We introduce the new laser dicing technology with a completely dry process in this show, It is called ”STEALTH DICING”.

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