ISRA VISION AG

Darmstadt, 
Germany
http://www.isravision.com
  • Booth: 7008

ISRA VISION AG is a globally leading supplier of optical solutions for 3D machine vision and surface inspection. Today, our automated and highly accurate solutions set the standards for the detection of material defects and total process control in numerous markets.

For semiconductor industry, ISRA has combined leading-edge technologies to provide high-speed and high-precision quality control along the production chain – universally applicable and intuitively easy-to-use.

Customers choose ISRA for its ability to develop products consistent to their requirements. Benefits are the identification of high efficiency enhancements and cost saving potentials. To achieve this goal, more than 700 ISRA employees worldwide are working to contribute to your success.


 Press Releases

  • A new inspection system now allows wafer edges to be monitored during the entire manufacturing process – both increasing yield and lowering costs, as the system prevents the processing of defective material. Moreover, because the sensor can be optionally integrated in existing process tools, it can be used in every production step.

    Today, the quality of wafers is often only checked at the start of production. However, the many processing steps put the material under a great deal of stress, particularly at the edge, and often cause quality issues. The high-speed surface inspection of the front, back and wafer edge is an efficient solution to this problem. This is necessary as chips are becoming ever thinner for use in modern IT and consumer electronics products, thus making them more vulnerable. Devices such as smartphones are gaining ever more functions, yet the amount of space for the hardware is limited. To meet the simultaneously increasing quality requirements, continuous inspection is required as early as the wafer manufacturing process.

    Customized deployment for critical process steps

    The EdgeScan from ISRA VISION can be used as an OEM product throughout the entire process and for every type of wafer. It is compatible with all common process tools and is also available as a retrofit solution for existing machines. Moreover, the solution’s connection and results output comply with the SEMI standard. The sensor unit can be deployed in an individual manner depending on where in the process the components are under the most stress. During preadjustment, a line scan camera checks the edge of the wafer simultaneously from three sides. Its multiview technology, in which a prism deflects the image by 45 degrees, creates three views, making it possible to view the component from 360 degrees even at cycle times of just a few seconds.

    This kind of inspection is a result of the new awareness that problems often begin at the edge. Defects here can cause cracks and breaks. EdgeScan now allows the edge to be monitored throughout the entire production process. ISRA’s solution complements conventional AOI systems that use a matrix camera, which have a limited field of vision and only inspect the surface, thereby enabling a complete inspection.

    This high quality can be guaranteed throughout the entire manufacturing process thanks to solutions from ISRA. For instance, CrackScan identifies micro cracks at the earliest possible stage and lays the groundwork for high-quality wafers and later chips. SurfQScan detects even the finest scratches on the polished, reflective surface of the finished wafer. And DicingScan enables inspection immediately following dicing, thereby covering a further process step that was previously not sufficiently monitored. The ISRA portfolio of products for inspecting semiconductors enables the maximum customer satisfaction through the very highest quality.


 Products

  • CrackScan
    Optical inspection system...

  • Optical inspection systems with dedicated illumination for detecting material defects like micro cracks, crystal dislocation etc. that occur during wafering process but also in wafer thinning/grinding/polishing steps as common in MEMS, power devices and wafer level packaging applications.

    Systems are available as stand-alone, manual loading units and can be connected to any standard EFEM, sorter or other wafer handling equipment via standard SEMI bolt interface to create a fully automated inspection unit for various tasks.

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