ITI

Oxnard,  CA 
United States
http://www.iti-abrasives.com
  • Booth: 3739


Welcome to ITI Dicing and Grinding.

ITI is a world leading manufacturer of superabrasive products focused on Precision Dicing Blades and Fine-Grinding (Flat-Honing) Plates. Our products are used globally on several applications including semiconductor packaging, glass, ceramics, crystals, composites, silicon carbide, hard disk drives, compound semiconductors, Chip-LED, quartz, and also a variety of metals. All of the superabrasive products that ITI provides are custom tailored for your application and process. We maintain our global presence with local representatives to serve our customers in over 25 countries. We are continuously improving our R&D and manufacturing process to enhance the quality & life of our products, which allows us to reduce the total cost-of-ownership for our customers. Please contact us to review your process and allow us to provide you with a cutting or grinding solution.


 Press Releases

  • JSKND01 Resin Bond Blade 

    ITI has developed a new resin bond diamond blade capable of satisfying our
    customers’ continuous need to improve the cut quality of specialized QFN applications,
    with increasing number of leads and copper volume.
    newly developed diamond with extreme friability and unique surface morphology and
    heat dissipating fillers ensures:
     Significant reduction in burr and smear.
     Allows high-speed processing - increased unit per hour
    (UPH).
     Increased blade structural integrity even at high surface
    speeds


 Products

  • New JSKND01 Resin Bond Blade
    Newly developed diamond insures significant reduction in burr and smear. Allows high-speed processing - increased unit per hour UPH Increased blade structural integrity even at high surface speeds...

  • New resin bond blade for specialized QFN applications and hard to cut materials. ITI has developed a new resin bond diamond blade capable of satisfying our customers’ continuous need to improve the cut quality of specialized QFN applications, with increasing number of leads and copper volume. The JSKND01 bond meets or exceeds stringent quality specifications of the automotive and defense sectors. The JSKND01 bond was developed to improve all aspects of the singulation process including smear, burr, and blade life.
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