UniTemp GmbH

Pfaffenhofen,  Germany 
Germany
http://www.unitemp.de
  • Booth: 2776


Thermal process equipment

UniTemp GmbH is a well known supplier for thermal process equipment like Rapid Thermal Annealing Ovens, Reflow Solder Ovens, Hot Plates and hot chucks. We supply labs as well as institutes and universities and R&D labs of famous semiconductor producers.


 Products

  • RTP-Series RTP/RTA Rapid Thermal Annealing ovens
    High precision RTP/RTA ovens for up to 1200 °C and high vacuum capable ...

  • Excellent ramp-up and ramp-down rates and high vacuum capable

    High precision RTP/RTA ovens for several applications like RTA  (annealing for silicon and compound semiconductor wafers), (RTO)  rapid thermal oxidation, (RTN) rapid thermal nitridation, rapid thermal diffusion from spin-on dopant, crystallization, contact alloying and more.

    Programming
    The systems are equipped with a 7” touch panel which allows easy and comfortable programming directly on the unit. 50 programs with 50 steps each can be stored.

    Temperature Distribution

    The max. temperature is up to 1200 °C (depends on model). Key features are precisely controlled fast ramp-up (up to 150 K/sec) and ramp-down rates (up to 200 K/min). External water cooling is required.

    Process Control
    The software allows the permanent monitoring, read-out and analysis of temperature, process gas flow, cooling water level status pressure value and status. Data logging in .csv format is default.

    Vacuum  
    The system is vacuum capable up to 10-6 hPa (as option). A membrane/ diaphragm pump, a chemically resistant pump and a rotary vane pump are available as accessories

  • VPO Vacuum Process Oven
    Vacuum Process Oven for up to 1000 °C and up nto 300mmx300mm substrate or 300mm wafer size...

  • Excellent ramp-up and ramp-down rates and
    high vacuum capable

    High precision VPO-1000-300 for several applications like RTA  (annealing for silicon and compound semiconductor wafers), (RTO)  rapid thermal oxidation, (RTN) rapid thermal nitridation, rapid thermal diffusion from spin-on dopant, crystallization, contact alloying and more.

    Programming
    The systems are equipped with a 7” touch panel which allows easy and comfortable programming directly on the unit. 50 programs with 50 steps each can be stored.

    Process Control
    The software allows the permanent monitoring, read-out and analysis of temperature, process gas flow, cooling water level status pressure value and status. Data logging in .csv format is default.

    Temperature Distribution

    The max. temperature is up to 1000 °C . Key features are precisely controlled fast ramp-up (up to 40 K/sec) and ramp-down rates (up to 200 K/min). External water cooling is required.

    Vacuum  
    The system is vacuum capable up to 10-6 hPa (as option). A membrane/ diaphragm pump, a chemically resistant pump and a rotary vane pump are available as accessories.

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