We serve you as VIP of Kostek Systems.
Through our own technology, we are producing wafer bonding system for essential process of semiconductor & LED
and also producing some equipment for semiconductor’s manufacturing area.
Through the opportunity of this China 2019 show, we want to make progress with you.
- Wafer Bonding System (Temporary Wafer Bonding / De-bonding System for TSV, FOWLP, Micro LED and Mini-LED)
- Chip Transfer System for Micro LED and Mini LED
- Laser Hybrid Bonding System for Micro LED and Mini LED
- Vacuum Cluster Tool / EFEM / N2 Purge LPM / Robot, etc.
Especially, we developed and applied Temporary wafer bonding system for the first time in Korea.
Come and experience the technological solutions you have and the advanced skills of the Kostek Systems.
We hope to see you at booth No.T1232.