Wafer-level Packaging (WLCSP) is the technology of packaging and testing an integrated circuit while at the wafer level and then slicing it into chips to make the completed product, which differs from the conventional method of slicing the processed wafer first into individual chips and then packaging them. WLCSP is a true chip-scale packaging technology.
Demand for WLCSP is increasing rapidly in the mobile market, due to the realization of a true chip-scale package with excellent electrical properties and price competitiveness. The WLCSP continues to expand its scope of application.
LB Semicon currently provides various layers of WLCSP solutions ranging from two layers to six layers tailored to meet the needs of our customers.
不同于以往的加工晶元后，一一切割芯片后，再进行封装的传统方式。晶圆级封装(Wafer Level Package) WLCSP将晶元进行封装和测试后，切割芯片，将完成品制作而成，是可实现芯片最小化的封装方法。WLCSP不仅可将芯片封装大小与芯片大小一致，还具备优秀的导电特性及较高的价格竞争力，得益于此，移动市场需求与日俱增，适用本技术的产品不断增多。如今，公司为满足客户需求，提供从2 layer至6 layer多样结构的WLCSP服务。