San Luis Obispo,  CA 
United States
  • Booth: T2317

Visit us to learn about our CMP, polishers & grinders.

Revasum offers a portfolio of market-leading wafer processing equipment. We provide premiere CMP, grinding and substrate manufacturing equipment to critical growth markets including silicon, power, RF communications, LED, MEMS, semiconductor and other mobile applications. Each of Revasum’s products is designed with the customer in mind. As a result, each of our tools meets or exceeds our customer’s requirements for quality, performance, and cost.


  • 6DS-SP
    We offer the 6DS-SP CMP system for high-volume production. The fully-automated 6DS-SP processes two wafers simultaneously and is equipped with two tables for multi-step processes....

  • The system provides automated, cassette-to-cassette handling for 100mm to 200mm. Motor current endpoint and GEM-SECS options round out the feature set. 

    • Efficient cassette-to-cassette handling automation for 100- 200mm wafers
    • Motor current endpoint
    • Powered pad conditioning
    • Optional third slurry system
    • HydroLift load station
    • Multi-Zone back pressure
    • Infrared temperature sensor
    • SEMI and CE compliant
    • Affordable, compact CMP
    • Dependable, high volume system
    • Maintains steady removal rate through hundreds of wafers
    • Excellent head-to-head uniformity
    • HydroLift load station with simple design = increased reliability
    • Two table design enables multi-step process capability
    • Endpoint Detection Reduces Scrap and Rework
    • Powered Pad Conditioning Extends Pad Life
    • Oxide baseline performance: <5% WIWNU 1 sigma at 3mm EE
  • 6DZ
    The 6DZ-II is the industry’s only fully automated, cassette-to-cassette, wax mount prime wafer polishing system and is one of Revasum’s leading products for high-volume silicon wafer manufacturing....

  • The 6DZ-II was designed specifically for prime wafer polishing with two main goals: to improve wafer-to-wafer consistency and to provide flatter wafers.

    • Consistent wafer-to-wafer results
    • Reliable, production-proven performance
    • Smaller footprint than batch systems
    • User-friendly software
    • A single wafer per polishing block
    • Fully automated
    • Controlled shape
    • Consistent wax application
    • Thermal stability
    • High yield
    • Low cost of ownership
    • Consistent wafer-to-wafer results
    • Hundreds of systems in operation worldwide
    • Controls surface damage and defects
    • Provides control over center-to-edge removal
    • More stable WTWNU
    • Produces, flatter wafers
    • Improved process control and better wafer to wafer consistency
  • 7AF
    Revasum’s 7AF is the upgraded version of our best-selling 7AF wafer grinder. The system is now equipped with modern controls and an efficient front end module.Full automation for 50mm to 200mm applications....

    • Real-time grind performance monitoring
    • A self-dressing grind process
    • Grind spindles can be fitted with coarse or fine wheels
    • Supports dual fine grind, dual coarse grind, and standard coarse/fine grind processing
    • Wafer flipping available for double-side grinding applications
    • In-situ, real-time thickness control
    • Air bearing spindles equipped with 8Hp motors
    • Robust, contemporary Windows 7 based operating system
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