SemiGlory Electronics (Chongqing) Co., Ltd

Rongchang,  Chongqing 
China
http://www.semiglory.com
  • Booth: T1123


Welcome to establish and develop business contacts with us!

         SemiGlory is a full-service designer and manufacture of transfer and handling products used in the ultra-clean chemical manufacturing process of semiconductor devices. 

         We have experienced design engineers focus on semiconductor packing and engineering plastic industry for over 20 years ,  SemiGlory can provide you customized products and services including secure wafer protection and precise automation interface, increasing yields and minimizing unscheduled downtime to meet your unique requirements.

         We are devoted to be a full service provider of semiconductor transfer and handling solutions.


 Products

  • Flex frame and Flex frame shipper
    Apply to wafer size ranges form 6 to 12 inches...

  • PPS fiber material provides enough strength and toughness to support blue film to carry wafers.
    Mirror-surface treated to ensure blue film is attached without bubbles and peeling off.
    Spring  design in the upper cover can effectively avoid the bandage frame movement, prevent wafer breakage, minimize particle generation.
  • Multi Horizontal Wafer Jar
    Apply to wafer size ranges from 5 to 8 inches...

  • The upper and lower covers are designed to facilitate the operator's opening and ensure the secure during transportation.

    Foam liner/isolator packaging is used to improve the shock-proof ability and provide effective protection for wafer transportation.

    Provide conductive PP and non conductive PP materials to facilitate customer choice.

    The design can effectively reduce the overall weight while beautifying the appearance

    The font is concave below the surface, effectively avoiding the risk of breaking HDPE bags during transportation

  • Multi Vertical Wafer Shipper
    Apply to wafer size ranges from 2 to 8 inches...

  • Interfaces with industry robotic handling equipment.

    Spring design minimizes lateral movement and particle generation.

    The combination design can effectively prevent cassette from moving.

    The design can effectively reduce the overall weight while beautifying the appearance.

  • Foam disc and Foam liner
    Apply to wafer canister and wafer jar. ...

  • The foam meets the EU RoHS/REACH directive and the world environmental regulations.

    The foam cushion disk and liner are all anti-static closed-cell polyethylene materials, the surface resistance is 105~1011

    Apply to wafer canister and wafer jar.

  • Multi Horizontal Wafer Canister
    Apply to wafer size ranges form 6 to 12 inches...

  • The inner ring design can effectively minimizes lateral movement  without applying compression on wafer edges.

    Lower lid inner ring finger design to improve aseismic strength.

    Interfaces with industry robtic handling equipment

    Secure 4 latches system and inner side impact resistant space design provide effective protection for wafer transportation process

    The design can effectively reduce the overall weight while beautifying the appearance

    The font is concave below the surface, effectively avoiding the risk of breaking HDPE bags during transportation.

  • Ring Separator and Paper Separator
    Apply to wafer size ranges from 5 to 12 inches...

  • The wafer separator paper uses Dupont  Tyvek  paper and Sakurai dust-free paper.

    Minimize reading error  and particle generation, with surface smooth and anti-static coated, PH neutral.

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