Planar JSC

  • Booth: 7132

KBTEM-OMO (Belarus): "Building Traditions Into the Future"

KBTEM-OMO (Belarus) is:

  • ~ 60 years in microelectronics engineering
  • High level vertical integration in R&D and manufacturing
  • Field proven tools for 1 µm, 0.6 µm, 0.35 µm, 0.13 µm, 90 nm and 65 nm technology node
  • Total solution provider for defect free mask manufacturing
  • Maskless lithography solution
  • Variety of wafer inspection systems
  • Unique solution for double-side lithography
  • Brand new tools only, no secondhand or refurbished tools

KBTEM-OMO performs scientific and technical development and production of special opto-mechanical process equipment as well as inspection and measurement equipment used in microelectronics products manufacture:

  • laser pattern generators for mask patterning;
  • laser-based mask repair systems;
  • automatic mask inspection systems with high detection threshold,
  • large-field steppers;
  • mask aligners;
  • direct writing systems
  • wafer steppers;
  • wafer inspection tools for macro and micro defect inspection


  • Mask Pattern Generation and Inspection tool set
    The range of the equipment for making the patterns on photomasks includes pattern generators, automatic inspection systems, laser photomask repair systems and photorepeaters....


    • 130, 90 nm UV, DUV laser tools

    • Multi-beam raster-scan technology

    • Phase shift mask production

    • Direct substrate patterning option

    • 16/32-beam optical architecture


    •130nm, 90 nm technology node

    •0.25, 0.15, 0.065 µm pixel size

    •Die-to-Database inspection to SEMI standards

    •High throughput


    • 0.2, 0.15 µm min feature size

    • Process switch to opaque/transparent defects repair

    • Pattern copy repair

    • Through pellicle repair

  • Wafer Pattern Generation and Inspection tool set
    Product range: - Direct writing pattern generator; - Mask Aligner - Wafer Stepper; - Automatic wafer defect inspection; - Wafer inspection....


    •1.0, 0.6, 0.35 µm single- and multi-beam laser pattern generators

    • Process switch to substrate/mask writing modes

    • Ø300, 200, 150, 100 mm


    • Contact / proximity printing

    • Automated / manual wafer loading

    • Double-side lithography

    • High alignment accuracy 0.4 ~0.7 um resolution

    - wedge compensation and wafer thickness compensation with no contact to mask;
    - 3D (X, Y, Q) high precision wafer manipulator with coarse and fine alignment modes;
    - irregular substrates type and size ( wafer thickness 0.2~0.8 mm, fragile wafer types (GaAs, LiNbO3, etc.) , rectangular;
    - built-in vibration protection unit;
    - energy saving mode.


    • Lamp / solid state laser light source

    • 0.8, 0.35 µm technology node

    • Automatic scaling

    • Double-side alignment

    • Ø200, 150, 100 mm wafers


    • Micro / macro defects inspection

    • Imposed defects inspection

    • High resolution

    • Low cost of ownership (COO)


    • CD inspection

    • Wafer flatness inspection

    • Coordinates and overlay inspection

    • Visual inspection

  • Optical Components
    Optical Components...

  • State of the art optical parts and coatings tailored to customer needs:

    - lens (including diffraction), prisms, wafers, magnifying glass;

    - bifocal spheroprismatic components;

    - spherical aerostatic  bearings;

    - reflectors, obtained by vacuum bending;

    - certified and testing photomasks;

    - extra precise grids, masks, scales; linear and angular targets, limbs, raster grids;

    - diffraction grating (including dividing grating, redistributing radiation in equal intensity), diffraction focuser, laser radiation converters (including converters into line, dots range, intersecting lines, ring);

    - microlens rasters on the optical glass and cylindrical lens;

    - components cells biraster;

    - diffusers, homogenizers;

    - optical coatings: interference, polarize, antireflected.

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