Yamaha Robotics Holdings Co., Ltd.

（★）Here is the exhibition equipment at this time.／这次的展览设备在这里。

Compression mold / 压缩成形模壓設備
+ WCM-330
    Automated Compression Molding System for WLP
    [WLP全自动压缩成型模壓系統]
+ WCM-330MS （★）
    Manual Compression Molding System for WLP/PLP   
    [WLP/PLP手动压缩成型系统]
+ LPM-600
    Large Panel Compression molding system
    [大型基板压缩成型模壓裝置]

Transfer Mold / 注塑成型模壓設備
+ GTM-X
    High performance molding system   
    [高性能封裝模壓裝置]
+ GTM-S
    Standard auto-molding system   
    [標準封裝模壓裝置]

Trim & Form System / 切斷成形設備
+ COMBO-300DC
    Trim & Form System   
    [T/F切斷成形裝置]
+ COMBO-300SW
    Trim & Forming System for Wider Leadframe   
    [T/F切斷成形裝置]

（★）Here is the exhibition equipment at this time.／这次的展览设备在这里。

Camera Module Proucts / 相机模组制造设备
+ A300Super（★）
  Active Alignment Bonder
    [全⾃动镜头搭载机]
+ HM-A200
  Active Alignment Bonder
    [全⾃动镜头搭载机]
＋ HM-A100D
Active Alignment Bonder for dual cameras
    [双摄像头⽤全⾃动镜头搭载机]
＋ HM-50
Lens Holder Mounter
    [模组搭载机]

Crystal Devices / ⽯英装置制造设备
＋ PBM-1100
Blank Mounter
    [点胶机]
＋ PMI-21
Mask Placer
    [排⽚机]
＋ PTTA-C5Z Ⅱ
Temperature Characteristic Inspection Equipment
    [温度特性测试设备]
＋ PLT-20
Frequency Adjustment Equipment
    [频率调整机]

Flat Panel Display Products
＋ FPD-I1300（★）
Indentation Inspection Machine (AOI)
    [压痕检查设备(AOI)]
＋ FPD-IMS1400
Indentation Inspection Machine (AOI)
    [压痕检查设备(AOI)]

"For Wafer alignment exposure application
应用于晶圆级别曝光"
"Best optics - high end LED intergrated with collimated light system
最好的光学 - 高端的 LED 配合平行光技术"
"High Resolution 2 um
高分辨率达到 2 um"
"Up to 200mm Wafer
最大支持 200mm 晶圆"
"Light intensity 25mw/cm2
光强度达 25mw/cm2"
"Multi contact modes supports Soft / Hard / Vacuum / Proximity
对应不同曝光模式包括软接触，硬接触，真空接触和间隙方式"
"Exposure gap is Laser measured and controlled.
曝光面间距以雷射光测量控制确保准确无误"

"High efficiency LED with high uniformity for long term usage
高效 LED 光源即使长期使用下光平均度仍能保持"
"Compatible with high speed robot wafer handling
开放的 I/O 可配置高速机械手臂保证准确和高效率"

"Dimension: Main system 1000 L x 1500 W x 1965 H (mm) ，Chiller 500L x 400W x 600H (mm）
尺寸: 主机 1000 L x 1500 W x 1965 H ，冷水机 500L x 400W x 600H"

Die Bonder/贴片机

+ SPA-1000

High-Accuracy Twin-Head Die Bonder
高精度双机头贴片机

+ STC-800

Discrete Application Die Bonder
用于Discrete的贴片机（共晶、WBC/DAF*、银浆）

Wire Bonders/焊线机

+ UTC-5000 Super Upgrade Series （★）

High Speed Wire Bonder with advanced functions
配备先进功能的高速焊线机

+ UTC-5100

 High Speed Wire Bonder for LED and Discrete Devices with Enhanced Productivity and Wide Frame Handling Capability
可对应宽大框架，适用于生产LED、Discrete的高速焊线机

Bump Bonders

+ SBB-5200

 Wide Area Handling High-speed Wafer Bump Bonder
对应晶圆的工作区域宽的高速植球机

Flip Chip Bonders/倒装贴片机

+ FPB-1 NeoForce

 Package Bonder for Multiple Processes
对应Multi process的灵活封装贴片机

+ YSB55w

 High-Speed & High-Accuracy Flip Chip Bonder
高速・高精度倒装贴片机