Advantest (China) Co.,Ltd.

Today's most advanced semiconductor processes allow for technology transformations that enable real-time integration of data from a countless number of sources such as IoT and handheld devices, automobiles and large servers to name a few. As mobile processors, high-performance computing (HPC) and artificial intelligence (AI) ICs evolve, the amount of data being processed continues to grow exponentially. Along with these advancements, new testing challenges, including very high scan-data volumes, extreme power requirements, fast yield-learning, and high-multisite configurations, need to be addressed. Advantest's new V93000 EXA Scale generation addresses these challenges with innovative advancements on the proven V93000 architecture.

The new V93000 EXA Scale™ SoC Test Systems are targeted at advanced digital ICs up to the exascale performance class. The systems' new test heads incorporate Xtreme Link™ technology, and the EXA Scale universal digital and power supply cards that enable new test methodologies, lower cost-of-test and faster time-to-market.

The new T2000 4.8GICAP module is designed to efficiently transfer data from CMOS image sensors (CIS) to the T2000 tester’s high-performance image processor engine (IPE). It is the first mass-produced test solution to achieve a maximum data rate of 3.5 Gsps for advanced C-PHY version 1.2 devices as well as the industry’s fastest capture speed of 4.8 Gbps for D-PHY version 2.1 devices.

The 4.8GICAP module, combined with Advantest's 3rd generation IPE, can simultaneously capture images and transfer data to the IPE using a two-bank memory mechanism. This will significantly reduce test time.

The Advantest V93000 Dynamic Parametric Test system powered by PDF Exensio® DPT, jointly developed by Advantest and PDF Solutions, adds rule-based, intelligent test flow adaptation to the V93000 SMU8 parametric test platform. With this technology, test flows are automatically optimized on-the-fly within milli-seconds to increase die test coverage, improve the characterization of aberrant measurements, correct equipment issues, and streamline the collection of additional data to support root-cause identification and down-stream analytics.

The new ACS edge HPC product can run complex test workloads with millisecond latencies and is available for early adopters. With pre-configured containers for machine learning (ML), demodulation, or other high-performance workloads, the system makes it easy to implement ML in semiconductor test. Besides allowing users to track, manage, and secure all containers from the cloud, it also provides on-demand access to previous insertion data through application programming interfaces (APIs) with built-in forward and backward data feeds. Customers can deploy machine learning models and algorithms in production, perform in-situ test flow optimizations, and remotely manage highly sensitive IP with maximum security.

The new TS9001 TDR system fully utilizes the company's unique terahertz technology to enable non-destructive and high-resolution analysis on circuit faults in advanced semiconductor packages, such as flip chip BGAs, wafer level packages, and 2.5D/3D ICs.

The TS9001 TDR System provides semiconductor manufacturers with flexible solutions for addressing a variety of failure analysis requirements. By establishing a low-cost failure analysis environment and enabling connections to high-frequency probing systems already in use by customers. TS9001 offers customers one of the shortest measurement times on the market.

Advantest's leading-edge semiconductor test technology, and terahertz failure analysis technology supports the development of innovative semiconductor supply chains, while enhancing the customers' quality control.