Advantest (China) Co.,Ltd.

  • Booth: 4431

Advantest (TSE: 6857) is the leading manufacturer of automatic test and measurement equipment used in the design and production of semiconductors for applications including 5G communications, the Internet of Things (IoT), autonomous vehicles, artificial intelligence (AI), machine learning, smart medical devices and more. Its leading-edge systems and products are integrated into the most advanced semiconductor production lines in the world. The company also conducts R&D to address emerging testing challenges and applications, produces multi-vision metrology scanning electron microscopes essential to photomask manufacturing, and offers groundbreaking 3D imaging and analysis tools. Founded in Tokyo in 1954, Advantest is a global company with facilities around the world and an international commitment to sustainable practices and social responsibility. More information is available at


  • New V93000 EXA Scale SoC Test Platform
    Leading-edge Technology Meets the Extreme Test Challenges of the Age of Convergence and Exascale Computing...

  • Today's most advanced semiconductor processes allow for technology transformations that enable real-time integration of data from a countless number of sources such as IoT and handheld devices, automobiles and large servers to name a few. As mobile processors, high-performance computing (HPC) and artificial intelligence (AI) ICs evolve, the amount of data being processed continues to grow exponentially. Along with these advancements, new testing challenges, including very high scan-data volumes, extreme power requirements, fast yield-learning, and high-multisite configurations, need to be addressed. Advantest's new V93000 EXA Scale generation addresses these challenges with innovative advancements on the proven V93000 architecture.

    The new V93000 EXA Scale SoC Test Systems are targeted at advanced digital ICs up to the exascale performance class. The systems' new test heads incorporate Xtreme Link technology, and the EXA Scale universal digital and power supply cards that enable new test methodologies, lower cost-of-test and faster time-to-market.

  • New T2000 4.8GICAP CMOS Image Capture Module
    Industry’s Fastest Capture Speed for D-PHY ICs and First 64-Site Test Solution for Advanced C-PHY Devices...

  • The new T2000 4.8GICAP module is designed to efficiently transfer data from CMOS image sensors (CIS) to the T2000 tester’s high-performance image processor engine (IPE). It is the first mass-produced test solution to achieve a maximum data rate of 3.5 Gsps for advanced C-PHY version 1.2 devices as well as the industry’s fastest capture speed of 4.8 Gbps for D-PHY version 2.1 devices.

    The 4.8GICAP module, combined with Advantest's 3rd generation IPE, can simultaneously capture images and transfer data to the IPE using a two-bank memory mechanism. This will significantly reduce test time.

  • New Advantest Cloud Solutions (ACS)
    Industry’s First Integrated Cloud-Based Software Solutions to Boost Production Efficiencies for New IC Designs...

  • The Advantest V93000 Dynamic Parametric Test system powered by PDF Exensio® DPT, jointly developed by Advantest and PDF Solutions, adds rule-based, intelligent test flow adaptation to the V93000 SMU8 parametric test platform. With this technology, test flows are automatically optimized on-the-fly within milli-seconds to increase die test coverage, improve the characterization of aberrant measurements, correct equipment issues, and streamline the collection of additional data to support root-cause identification and down-stream analytics.

    The new ACS edge HPC product can run complex test workloads with millisecond latencies and is available for early adopters. With pre-configured containers for machine learning (ML), demodulation, or other high-performance workloads, the system makes it easy to implement ML in semiconductor test. Besides allowing users to track, manage, and secure all containers from the cloud, it also provides on-demand access to previous insertion data through application programming interfaces (APIs) with built-in forward and backward data feeds. Customers can deploy machine learning models and algorithms in production, perform in-situ test flow optimizations, and remotely manage highly sensitive IP with maximum security.

  • New H5620ES System
    New IC Memory Tester That Integrates Burn-In and Core Testing for 5G Product Development...

  • The new, highly versatile H5620ES engineering test system is designed for both high-speed burn-in and core testing of today's DDR4, next-generation DDR5, and low-power, double-data-rate (LPDDR) devices in laboratory environments. By streamlining the number of accessories and reducing the time required between burn-in and core testing, the new H5620ES shrinks the cost of test for evaluating advanced memory devices used throughout 5G applications. Like its sister system, the H5620 production unit introduced in March of this year, the new tester delivers high productivity by parallel testing both DDR4 and DDR5 memories. It can accommodate memory ICs with 100-MHz frequencies and 200-Mbps data rates. The engineering system is optimized for ease of use in product development. Its compact design saves space and enables mobility in laboratory environments while its open-top architecture makes it easy to perform pick-and-place operations without removing the device interface board (DIB).
  • New TS9001 TDR System
    New Time Domain Reflectometry (TDR) System Employs Terahertz Technology to Provide High Resolution Analysis of Circuit Faults...

  • The new TS9001 TDR system fully utilizes the company's unique terahertz technology to enable non-destructive and high-resolution analysis on circuit faults in advanced semiconductor packages, such as flip chip BGAs, wafer level packages, and 2.5D/3D ICs.

    The TS9001 TDR System provides semiconductor manufacturers with flexible solutions for addressing a variety of failure analysis requirements. By establishing a low-cost failure analysis environment and enabling connections to high-frequency probing systems already in use by customers. TS9001 offers customers one of the shortest measurement times on the market.

    Advantest's leading-edge semiconductor test technology, and terahertz failure analysis technology supports the development of innovative semiconductor supply chains, while enhancing the customers' quality control.

For Technical Support with this webpage, please contact support.