Luva System Inc.

Guangzhou, 
China
http://www.luvasystem.com
  • Booth: T2132

Welcome to Luva System Inc,Your Faithful Partner.

Founded in May 2001 in Silicon Valley California, a representative & distributor in China for semiconductor equipment manufacturing OEM.  Luva System Inc. serves your customers as a rep for manufacturers but not only that. It provides professional consulting experience and service. In its portfolio there never lacks prestiged industry leaders, like  Lehighton Electronics (LEI),  AnealSys, C&D Semiconductor, 4Dimensions, Frontier Semiconductor(FSM), Kinetics, Wafab International, TPT,  Axic, Dynatex, Advanced Instrument Technology(AIT), MMR Technologies, KLA-Tencor, Spectral Dynamics, Revasum, Entrepix, Mikropack, Woollam, Angstrom Sun Technologies, JFP Microtechnic,.etc. Customer satisfaction is not only its goal but also a day-to-day practice. Customer needs set for Luva System priority of work. Please visit our web site www.luvasystem.com.

Categories

200 Equipment, Assembly
  • Backgrind; Slicing; Lapping; Polishing Equipment
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Dicing; Sawing; Scribing; Separation Equipment
  • Die Bonding; Attach Equipment
  • Die Removal Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Dispensing Systems
  • Marking; Imprinting; Labeling Equipment
  • Plating; Electro Chemical Plating for device assembly
  • Wafer Level Bonders
  • Wafer Mount; Taping Equipment
  • Wire Bonding Equipment
    • 201 Equipment, Flat Panel Display
  • Scribe and Break Equipment
    • 202 Equipment, General Use
  • Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating
    • 203 Equipment, Inspection & Measurement
  • CV (capacitance-to-voltage) Probe systems
  • Defect; Particle; Bump; Contamination Detection, Review or Inspection
  • Die Inspection; Die Shear
  • Film Thickness; Thickness; Uniformity Measurement; Ellipsometer
  • Leak Detection Systems - Vacuum or Gas
  • Resistivity Measurement; 4 point probe; Sheet resistance
  • Stress; Refractive Index; Reflectivity & Conductivity Measurement
  • Thermal Sensing, Measurement, Analysis
  • Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation
  • Wire Bonding Inspection; Test
    • 204 Equipment, Mems
  • Deep RIE etching; Dry Etching
  • Wafer Level Bonders
    • 207 Equipment, Process
  • Bumping Systems
  • Chemical Mechanical Polishing (CMP); Electro Polishing, Mechanical Polishing Equipment
  • Coat; Develop; Resist Processing; Track Equipment
  • Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD
  • Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment
  • Etching; Stripping; Ashing - Dry and Wet Equipment
  • Ion Implantation Equipment
  • Plating; Electro Chemical Plating; Deposition Systems
  • SOI Bonders; Temporary Bonders; De-Bonders
  • Spin on Glass (SOG); on Dielectric (SOD) Track systems
  • Thermal Processing - Diffusion; Oxidation; Annealing; RTA; RTP Equipment
    • 208 Equipment, Test
  • Optical Test Systems
  • Package Test Systems
    • 300 Materials, Assembly
  • Scribe Tools; Saw or Dicing Blades and Accessories
    • 308 Materials, Substrate
  • Compound Semiconductor substrates (GaAs on Silicon; GaN; InP; SiGe, etc.)
    • 309 Materials, Test
  • Probe Cards; DUT boards and other probing accessories (incl Ceramic and Special Purpose Probe Cards)
    • 901 Solar
  • Solar Cells, Wafers
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