Taiji Semiconductor (Suzhou) Co., Ltd

Suzhou,  Jiangsu 
China
  • Booth: 5547


We assemble your future with joy and happiness around you !

Taiji Semiconductor is the state-holding OSAT in China, Providing the turn-key service to customer in RD, assembly, testing and SMT . The package types cover wBGA、FBGA、FlipChip、MCP、UDP、LGA、 SOP48I&54II&66II、QFP、QFN、MEMS、Micro SD、USB、SIM. Some technologies with independent  self-patents are staying in leading positions over the field.

 Products

Categories

200 Equipment, Assembly
  • Cut & Down Set; Trim; Form Equipment
  • Dicing; Sawing; Scribing; Separation Equipment
  • Die Bonding; Attach Equipment
  • Marking; Imprinting; Labeling Equipment
  • Molding; Encapsulation; Decapsulation Equipment
  • Package Simulation; Characterization Equipment
  • Solder Reflow; Soldering & Brazing Equipment
  • Wafer Mount; Taping Equipment
  • Wire Bonding Equipment
  • Backgrind; Slicing; Lapping; Polishing Equipment
  • Ball Placement; Attach Systems
  • Cleaning; Washing Equipment for Assembly & Packaging
    • 203 Equipment, Inspection & Measurement
  • Acoustic Spectroscopy; Electron Spectroscopy for Chemical Analysis (ESCA); Ultrasonic; Acoustical Mi
  • Die Inspection; Die Shear
  • Film Thickness; Thickness; Uniformity Measurement; Ellipsometer
  • Microscopes: Optical Microscopes
  • Package Inspection; Lead Scanners
  • Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation
  • Weight measurement; precision scales
  • Wire Bonding Inspection; Test
  • X-ray; XRF; 3-D X-Ray; LEXES Systems
    • 204 Equipment, Mems
  • Double sided mask aligner
    • 207 Equipment, Process
  • Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
    • 208 Equipment, Test
  • Burn-In Accessory Systems
  • Burn-In Systems
  • Circuit Repair; Design Modification; Redundant Memory Repair; Mask Repair Systems
  • Functional Test Systems
  • Logic Test Systems
  • Memory Test Systems
  • Package Test Systems
    • 300 Materials, Assembly
  • Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive
  • Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools
  • Lead Frames & Headers: Etched; Stamped
  • Marking ink
  • Molding; Encapsulation; Potting; Resin Materials
  • Package Substrates; Laminate; Film based
  • Packages; Ceramic and Other High Temp Compounds
  • Packages; Plastic
  • Preforms; Lids
  • Scribe Tools; Saw or Dicing Blades and Accessories
  • Solder; Solder Balls and other Soldering Materials
  • Tape Automated Bonding (TAB) Accessories
  • Thick Film Pastes; Materials
  • Thin Film; Dielectric Film Materials
    • 602 Manufacturing Software
  • Yield Mgmt; Process Control Software
    • 701 Manufacturing Services or Consulting
  • Assembly
  • Manufacturing Process Support and Development
  • Test Services or Consulting
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