Toray Engineering Co., Ltd.

Otsu,,  SHIGA 
Japan
http://www.toray-eng.co.jp
  • Booth: 4707

Welcome to Toray Engineering

Toray engineering propose total solution in the semiconductor and FPD manufacturing with original manufacturing device, inspection device and analysis device.1.Wafer pattern inspection, 2.Flip chip bonder,3.Bonder for embedded packaging,4.Vacuum printing encapsulation system,5.3-D Non-Contact Surface Profiler,6.Zirconia Type Oxygen Gas Analyzer.

Categories

200 Equipment, Assembly
  • Wafer Level Bonders
  • Wire Bonding Equipment
  • Die Bonding; Attach Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Printing Equipment; Screen-printing; Alignment ; Film Printing
    • 203 Equipment, Inspection & Measurement
  • Defect; Particle; Bump; Contamination Detection, Review or Inspection
  • Die Inspection; Die Shear
  • Film Thickness; Thickness; Uniformity Measurement; Ellipsometer
    • 204 Equipment, Mems
  • Wafer Level Bonders
    • 901 Solar
  • PV Manufacturing Equipment: Inspection and Metrology
  • PV Manufacturing Equipment: Thin Film
  • PV Manufacturing Equipment: Wafers
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