SET CORPORATION SA

With ± 1 µm post-bond accuracy in stand-alone or full automatic mode, the NEO HB is an automatic flip-chip bonder designed for production.

It is suitable for hybrid / direct bonding processes.

Combining high precision, flexibility and very short cycle time, it is pefectly suitable for hybrid / direct bonding processes (metal-to-metal or oxide-to-oxide), at room temperature and at low bonding force.

Key Benefits

  Closed-loop systems to guarantee a high repeatability in operations

  Ultra-high cleanliness - ISO 3

  Compatible from stand alone to full automatic

  User-friendly interface for multiple applications and processes

 High Force, particularly interesting for Cu-Cu bonding as used in 3D-IC packaging, or Nanoimprinting using a Hot Embossing Lithography process;

 Low Force Reflow Bonding for imaging devices, RF, or Optoelectronics assembly;

 UV-Curing for Adhesive Bonding or for Nanoimprinting using a UV-NIL process.

Key Benefits

  ± 0.5 µm post-bonding accuracy and 20 µradians leveling guarantee highest quality for the most advanced products

  Semi-Open Confinement Chamber for Oxide Reduction (option) 

  Bonding of devices up to 100 x 100 mm onto wafer up to 300 mm to enable large format assemblies

  NIL configuration as add-on to bonding capability for maximum flexibility

  Air bearing construction on a granite structure ensures long-term stability and reliability

  Optional integrated chamber for gang reflow in a gas or vacuum environment

With configurations ranging from manual to full automation, the FC150 provides development and production capabilities on a single upgradeable cost-effective platform. The high degree of flexibility offered on the FC150 makes it the machine of choice for advanced research with the ability to move directly into pilot production.

Able to level, align and bond components ranging in size from 0.2 to 100 mm, the FC150 supports a complete range of bonding applications, including Reflow, Thermo-compression, Thermosonic, Adhesives and Fusion bonding. Active leveling is made possible through a motorized pitch & roll system combined with autocollimation or laser leveling. Designed to maximize accuracy and versatility, the FC150 answers almost every need in high-end bonding applications.

• The ACCμRA M is a manual flip-chip bonder that permits to align manually the components with a high level of precision.

It allows ± 3 μm accuracy.The motorized arm controls precisely the bonding force.

Combining and synchronizing the arm with the temperature controller, it guarantees a perfect quality and high repeatability of your process.

The ACCμRA M, more than a pick-and-place system, offers thermocompression and reflow capabilities.

It is the perfect equipment for universities and R&D institutes.

• The ACCμRA OPTO is a flip-chip bonder that allows ± 0.5 μm accuracy.

It is dedicated to low force and reflow processes.

Motorized axes guarantee a high repeatability of your process.

The ACCμRA OPTO combines high precision, flexibility and accessibility.

It is the perfect equipment for optoelectronics and silicon photonics applications.

• The ACCµRA100 is a semi-automatic flip-chip bonder that guarantees +/- 0.5 µm post-bonding accuracy.

Its flexibility makes it ideal for developing a wide range of applications.

The ACCµRA100 combines high precision, accessibility and cost-effectiveness.

It is the perfect equipment for universities and R&D institutes.

• The ACCμRA Plus is a flip-chip bonder designed for ± 0.5 μm accuracy in full automatic mode.

It is suitable for reflow and thermocompression processes.

The ACCμRA Plus combines high precision, flexibility and short cycle time.                                                                                                                                  

It is dedicated to production for optoelectronic and silicon photonics applications.