BE Semiconductor Industries N.V.
Accuracy Meets Productivity!
Besi is engaged in one line of business, the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries.
Besi supplies leading edge systems offering increased productivity, improved yields of defect-free devices and a low cost of ownership. Besi offers customers a broad portfolio of systems which address substantially all the assembly process steps involved in leadframe, substrate and wafer level packaging. Besi''s principal product offerings include:
Die Attach Equipment
Single chip, multi chip, multi module and flip chip die bonding systems and die sorting systems.
Packaging Equipment
Molding, trim & form and singulation systems.
Plating Equipment
Tin, copper and precious metal plating systems.
Services
Besi provides tooling, conversion kits and spare parts to its installed base of customers worldwide.