Logitech welcomes you to Semicon China 2017
Logitech Ltd. design and manufacture precision bonding, cutting, lapping, polishing and CMP equipment.
Our systems are used in the precision processing of semiconductor, laser, optoelectronic and fibre optic materials, where there is a need for extremely high standards of material flatness and parallelism.
A Logitech system is typically used for processing:
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Wafers and devices up to 200mm.
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IC cross sections.
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Optical components - LiNbO3, LiTaO3 & Sapphire.
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Laser rods - YAG & YVO4.
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Photovoltaic materials - CdTe & CIGS.
A complete Logitech solution for wafers and devices would typically include:
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A precision saw offering minimal kerf loss.
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Bonding system for processing delicate, ultra thin materials
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Jig controlled lapping machine for backlapping or thinning of wafers
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Polishing machine for chemical-mechanical polishing - essential for II-V and III-V materials.
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Measurement and inspection facilities to suit the required end result.