Welcome to SPT-Small Precison Tools Co Ltd
Looking for Longer Capillary Tool Life for Copper Wire Bonding? Bonding Capillary Designs & Total Solutions for Enhanced Ball & Stitch Bond Performance for Copper Wire Bonding on QFN package SPT invites you to visit our booth to view our latest launch! SPT is the world''s leading supplier of semiconductor wire & die bonding tools. Our wide range of products include - Capillaries for Copper and Gold wire bonding interconnect applications ranging from standard to ultra fine pitch; - Ultrasonic wedges for ultrasonic aluminum and gold wire bonding; - Specialized tools for specific bonding application - Microloy Osmium-Carbide Alloy Wedge, and µBGA TAB bonding tools; - Die attach collets for eutectic die bonding, epoxy and under-fill Dispensing tools, Pick-up tools, Window Clamp & Heater block and customized micro miniature tools & accessories in steel, carbide and ceramics, both by CNC and Ceramic Injection Molding.