(★)Here is the exhibition equipment at this time./这次的展览设备在这里。
Die Bonder/贴片机
+ SPA-1000
High-Accuracy Twin-Head Die Bonder
高精度双机头贴片机
+ STC-800
Discrete Application Die Bonder
用于Discrete的贴片机(共晶、WBC/DAF*、银浆)
Wire Bonders/焊线机
+ UTC-5000 Super Upgrade Series (★)
High Speed Wire Bonder with advanced functions
配备先进功能的高速焊线机
+ UTC-5100
High Speed Wire Bonder for LED and Discrete Devices with Enhanced Productivity and Wide Frame Handling Capability
可对应宽大框架,适用于生产LED、Discrete的高速焊线机
Bump Bonders
+ SBB-5200
Wide Area Handling High-speed Wafer Bump Bonder
对应晶圆的工作区域宽的高速植球机
Flip Chip Bonders/倒装贴片机
+ FPB-1 NeoForce
Package Bonder for Multiple Processes
对应Multi process的灵活封装贴片机
+ YSB55w
High-Speed & High-Accuracy Flip Chip Bonder
高速・高精度倒装贴片机