• Booth: 7780

SET is pleased to invite all valued visitors at booth #7780.

SET, Smart Equipment Technology, is a world leading supplier of high accuracy Flip-Chip Bonders and versatile Nanoimprint Lithography (NIL) solutions.

We accompany laboratories and industries of semiconductor, which look for a high precision and an important reliability in the assembly of their components in their projects, and accelerate their developments of the chips of future thanks to our robust and precise flip-chip bonders.

As a supplier of semiconductor equipment dedicated to high precision applications since 1975, SET has developed more than 34 different types of equipment. With several hundreds of Device Bonders installed worldwide, SET is globally renowned for the unsurpassed sub-micron accuracy and the flexibility of its bonders.

First introduced in 1981, the Flip-Chip Bonder line became the primary focus of the company in 1997. Ranging from manual loading to fully automated version, our bonders cover a wide range of bonding applications and offer the unique ability to handle and bond fragile and small components onto substrate up to 300 mm.


  • New Production Equipment for Hybrid Bonding NEO HB
    NEO HB is a flip-chip bonder designed for ± 1 µm @ 3σ accuracy in stand-alone or full automatic mode (EFEM)....

  • With ± 1 µm post-bond accuracy in stand-alone or full automatic mode, the NEO HB is an automatic flip-chip bonder designed for production.

    It is suitable for hybrid / direct bonding processes.

    Combining high precision, flexibility and very short cycle time, it is pefectly suitable for hybrid / direct bonding processes (metal-to-metal or oxide-to-oxide), at room temperature and at low bonding force.

    Key Benefits

      Closed-loop systems to guarantee a high repeatability in operations

      Ultra-high cleanliness - ISO 3

      Compatible from stand alone to full automatic

      User-friendly interface for multiple applications and processes

  • FC300
    The FC300 High Precision Die / Flip Chip Bonder is the newest generation of high accuracy and high force system for chip-to-chip and chip-to-wafer bonding, on wafers up to 300 mm....

  • The tool features automated handling of chips and substrates up to 100 mm from waffle packs, plus a robotic option enabling chip picking from diced wafer and automated handling of larger substrate. It features also Nanoimprinting Lithography (NIL) capabilities.

    With a quick process head reconfiguration, the FC300 platform performs multiple applications including:

     High Force, particularly interesting for Cu-Cu bonding as used in 3D-IC packaging, or Nanoimprinting using a Hot Embossing Lithography process;

     Low Force Reflow Bonding for imaging devices, RF, or Optoelectronics assembly;

     UV-Curing for Adhesive Bonding or for Nanoimprinting using a UV-NIL process.

    Key Benefits

      ± 0.5 µm post-bonding accuracy and 20 µradians leveling guarantee highest quality for the most advanced products

      Semi-Open Confinement Chamber for Oxide Reduction (option) 

      Bonding of devices up to 100 x 100 mm onto wafer up to 300 mm to enable large format assemblies

      NIL configuration as add-on to bonding capability for maximum flexibility

      Air bearing construction on a granite structure ensures long-term stability and reliability

      Optional integrated chamber for gang reflow in a gas or vacuum environment

  • FC150
    With ± 0.5 µm placement accuracy and ± 1 µm post-bond accuracy, the SET FC150 Die/Flip Chip Bonder offers the latest evolutions in bonding techniques....

  • With configurations ranging from manual to full automation, the FC150 provides development and production capabilities on a single upgradeable cost-effective platform. The high degree of flexibility offered on the FC150 makes it the machine of choice for advanced research with the ability to move directly into pilot production.

    Able to level, align and bond components ranging in size from 0.2 to 100 mm, the FC150 supports a complete range of bonding applications, including Reflow, Thermo-compression, Thermosonic, Adhesives and Fusion bonding. Active leveling is made possible through a motorized pitch & roll system combined with autocollimation or laser leveling. Designed to maximize accuracy and versatility, the FC150 answers almost every need in high-end bonding applications.

    Key Benefits

      ± 1 µm post-bond accuracy and 20 µradian leveling guarantee high yields on the most advanced products

      Semi-Open Confinement Chamber for Oxide Reduction (option)

      Air bearing construction on a granite structure ensures long-term stability and reliability

      Compression, Z-control and temperature profiling, together with process monitoring, maximize process control

      Optical automatic leveling and alignment enables hands-off operation for production applications

      Nanoimprint Lithography option with Hot Embossing or UV-NIL process without compromising the bonding capability


    • The ACCμRA M is a manual flip-chip bonder that permits to align manually the components with a high level of precision.

    It allows ± 3 μm accuracy.The motorized arm controls precisely the bonding force.

    Combining and synchronizing the arm with the temperature controller, it guarantees a perfect quality and high repeatability of your process.

    The ACCμRA M, more than a pick-and-place system, offers thermocompression and reflow capabilities.

    It is the perfect equipment for universities and R&D institutes.

    • The ACCμRA OPTO is a flip-chip bonder that allows ± 0.5 μm accuracy.

    It is dedicated to low force and reflow processes.

    Motorized axes guarantee a high repeatability of your process.

    The ACCμRA OPTO combines high precision, flexibility and accessibility.

    It is the perfect equipment for optoelectronics and silicon photonics applications.

    • The ACCµRA100 is a semi-automatic flip-chip bonder that guarantees +/- 0.5 µm post-bonding accuracy.

    Its flexibility makes it ideal for developing a wide range of applications.

    The ACCµRA100 combines high precision, accessibility and cost-effectiveness.

    It is the perfect equipment for universities and R&D institutes.

    • The ACCμRA Plus is a flip-chip bonder designed for ± 0.5 μm accuracy in full automatic mode.

    It is suitable for reflow and thermocompression processes.

    The ACCμRA Plus combines high precision, flexibility and short cycle time.                                                                                                                                  

    It is dedicated to production for optoelectronic and silicon photonics applications.

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